Co-Packaged Optics Module With SOH Modulator for Compact Thermal Stability
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Solution Overview
Problem
Current high-speed optical modulators, such as Mach-Zehnder and micro-ring modulators, face challenges in miniaturization, power consumption, and temperature sensitivity, making them unsuitable for mass production.
Innovation Solution
A co-packaged optics chip module integrating a silicon-organic-hybrid modulator and photodetector on a silicon substrate, utilizing a silicon photonic slot waveguide and organic electro-optical material, with electrodes shared on the same film layer, and including a heat sink for thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Mach-Zehnder modulators are used, then modulation performance is achieved, but component size becomes large and power consumption increases
Solution Approach 1:
The patent changes the material parameter from traditional lithium niobate to organic electro-optical material, which has different electro-optical coefficients and allows for more compact design while maintaining modulation performance. The organic material enables smaller component size due to its superior electro-optical properties
Solution Approach 2:
The patent uses composite material structure combining organic electro-optical material with silicon photonic waveguide. This composite approach leverages the low-loss transmission of silicon waveguide and the high electro-optical efficiency of organic material, achieving both small size and good modulation performance
2Area of stationary object
If micro-ring modulators are used, then component size is reduced, but photoelectric efficiency decreases and temperature sensitivity increases
Solution Approach 1:
The patent adopts the compact ring resonator design concept from micro-ring modulators but creates an improved version using organic electro-optical material. The ring-shaped structure is copied and adapted to achieve small size while the organic material compensates for the photoelectric efficiency and temperature sensitivity issues
Solution Approach 2:
The patent changes the operating parameter regime by using organic material with different thermal and optical properties. This material substitution reduces temperature sensitivity and maintains photoelectric efficiency while preserving the compact size advantage of ring-based designs
3Area of stationary object
If micro-ring modulators are used, then component size is reduced, but temperature sensitivity increases
Solution Approach 1:
The patent changes the material parameter to organic electro-optical material, which has different thermal expansion coefficient and refractive index temperature dependence compared to traditional materials. This parameter change reduces the sensitivity to temperature variations while maintaining compact component size
Solution Approach 2:
The patent introduces a thermal management structure as an intermediary between the modulator and the environment. This mediator controls heat dissipation and temperature distribution, reducing temperature sensitivity effects on the compact modulator
4Ease of manufacture
If integrated design is used, then mass production feasibility is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functional components (modulator, photodetector, and interposer substrate) into a single integrated package. This combining reduces the number of separate manufacturing steps and assembly operations, improving mass production feasibility while the modular functional blocks keep the design complexity manageable
Solution Approach 2:
The patent designs the interposer substrate with multi-functional capabilities, serving as both a mechanical support structure and an electrical interconnection platform. This universal design consolidates multiple functions into a single component, reducing overall device complexity while enabling integrated manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves low power consumption, small component size, and wide operating temperature range, enabling both light emission and reception functions, suitable for mass production.
Implementation Method 1
an organic electro-optical material filling a slot of the silicon photonic slot waveguide
Implementation Method 2
the photodetector includes a first-type semiconductor layer, a second-type semiconductor layer
Data Source
AI summary
A co-packaged optics chip module includes a silicon substrate, a silicon-organic-hybrid modulator, a driving element, a photodetector, and an amplifier. The silicon-organic-hybrid modulator is disposed on the silicon substrate. The driving element is disposed on the silicon substrate and is electrically connected to the silicon-organic-hybrid modulator. The photodetector is disposed on the silicon substrate. The amplifier is disposed on the silicon substrate and is electrically connected to the photodetector. The silicon-organic-hybrid modulator and the photodetector are integrated on the silicon substrate.