Co-Packaged Optics Waveguide Interconnects
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Solution Overview
Problem
The increasing complexity of IC processing and manufacturing due to the scaling down of geometry size in IC evolution requires advancements in package processing and manufacturing, particularly in co-packaged optics to achieve higher capacities, lower power consumption, and increased data speeds.
Innovation Solution
The development of a co-packaged optics device that integrates electrical and optical components, featuring a waveguide component with intersecting waveguide channels and fiber array units, which allows for flexible optical signal transmission paths and efficient interconnectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If geometry size is scaled down in IC evolution, then production efficiency increases and costs decrease, but processing and manufacturing complexity increases
Solution Approach 1:
The patent combines optical components and electrical components into a single co-packaged optics device, integrating waveguide channels, optical transceivers, and electronic circuits within the same package footprint. This merging approach increases functional density without requiring separate packaging processes, thereby improving production efficiency while managing the complexity of integrated manufacturing
Solution Approach 2:
The package substrate serves multiple functions simultaneously: it provides mechanical support for both optical and electrical components, establishes electrical connections through redistribution circuits, and enables optical signal transmission through waveguide channels. This multi-functionality reduces the number of separate components and assembly steps, improving productivity without proportionally increasing processing complexity
2Area of moving object
If co-packaged optics integrates electrical and optical components, then footprint decreases and data speeds increase, but manufacturing complexity increases
Solution Approach 1:
The device is segmented into distinct functional modules: waveguide channels for optical transmission, optical transceivers for signal conversion, and electronic circuits for data processing. Each module can be fabricated and tested independently before final integration, reducing manufacturing complexity while achieving compact footprint through systematic arrangement of segmented components
Solution Approach 2:
The patent transitions from planar integration to three-dimensional co-packaging by stacking optical and electrical components vertically within the package. Waveguide channels extend through multiple layers, connecting optical transceivers positioned at different heights. This dimensional approach increases functional density and reduces footprint while allowing separate fabrication processes for optical and electrical layers, simplifying manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances interconnecting bandwidth density and energy efficiency by shortening electrical link lengths, enabling higher data speeds and lower power consumption while maintaining a compact footprint.
Implementation Method 1
a waveguide component with intersecting waveguide channels... allowing for flexible optical signal transmission paths
Data Source
AI summary
An opto-electronic module and a co-packaged optics device included therein are provided. The co-packaged optics device can include a package substrate; an electronic component disposed on the package substrate; optical transceivers disposed on the package substrate, arranged around the electronic component, wherein the electronic component is electrically connected to the optical transceivers; and a waveguide component disposed on the package substrate. The waveguide component includes a waveguide bulk having an inward surface facing the optical transceivers and an outward surface opposite to the inward surface; a first waveguide channel embedded in the waveguide bulk and extending from the outward surface to the inward surface; and a second waveguide channel embedded in the waveguide bulk and extending from the outward surface to the inward surface, wherein the first waveguide channel and the second waveguide channel are intersected and directed to different ones of the optical transceivers.