Co-Packaged Optoelectronic Module for High Density Data Transmission

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Solution Overview

Problem

The increasing demand for data transmission density in modern communication systems necessitates a miniaturized optoelectronic module to accommodate more functional components in limited space, as traditional optoelectronic modules occupy excessive volume.

Innovation Solution

A co-packaged integrated optoelectronic module comprising an optoelectronic submodule, a slave microprocessor, and a master microprocessor integrated on a carrier board, which includes a digital signal processing chip, an optoelectronic signal analog conversion chip, and an optical transceiver chip, allowing for efficient data transmission and module monitoring within a compact form factor.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the number of optoelectronic modules is increased to increase data transmission density, then the data transmission density is improved, but the volume of the switch increases

Engineering Contradiction:

Improvedata transmission densityVSAvoidvolume of the switch

Core Design Contradiction:

ProductivityVSVolume of stationary object

Solution Approach 1:

The patent merges the master microprocessor, slave microprocessor, and optoelectronic submodule into a single integrated module packaged on a carrier board. This consolidation reduces the overall volume required compared to separate modules, allowing more modules to be accommodated in limited space while maintaining high data transmission density

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from traditional three-dimensional module stacking to a two-dimensional carrier board integration approach. By layouting components on a planar carrier board, the design achieves compact footprint and enables higher module density without proportionally increasing volume

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Productivity

If traditional optoelectronic modules are used, then the data transmission function is provided, but the module size does not meet the miniaturization requirements

Engineering Contradiction:

Improvedata transmission functionVSAvoidmodule size

Core Design Contradiction:

ProductivityVSVolume of moving object

Solution Approach 1:

The patent combines multiple functional components (master microprocessor, slave microprocessor, optoelectronic submodule) into a single integrated module. This merging eliminates the need for separate modules and reduces overall system volume while maintaining complete data transmission functionality

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated module performs multiple functions simultaneously: the master microprocessor handles high-speed signal processing and initialization, the slave microprocessor monitors operations, and the optoelectronic submodule handles optical conversion. This multi-functionality in a single compact unit achieves miniaturization without sacrificing performance

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables increased data transmission density and miniaturization of the optoelectronic switch, accommodating more modules in a limited space while effectively monitoring and controlling the overall operation, thus meeting market development needs.

Implementation Method 1

The digital signal processing chip is configured to convert an electrical analog signal, which is received, into an electrical digital signal

Methodology Applied

Scientific EffectSignal processing:

Implementation Method 2

The optoelectronic signal analog conversion chip is configured to convert an optical analog signal into the electrical analog signal

Methodology Applied

Scientific EffectOptoelectronic conversion:

Implementation Method 3

The optical transceiver chip is configured to receive and transmit the optical analog signal to the optoelectronic signal analog conversion chip

Methodology Applied

Scientific EffectOptical signal transmission:

Data Source

PatentUS20250023642A1Co-packaged integrated optoelectronic module and co-packaged optoelectronic switch chip

Publication Date: 2025.01.16 DONGGUAN LUXSHARE TECH CO LTD

AI summary

Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically connected to the carrier board. In the optoelectronic submodule, a digital signal processing chip converts an electrical analog signal into an electrical digital signal, an optoelectronic signal analog conversion chip converts an optical analog signal into the electrical analog signal to the digital signal processing chip, and an optical transceiver chip receives and transmits the optical analog signal to the optoelectronic signal analog conversion chip. The slave microprocessor monitors operation of the optoelectronic submodule. The master microprocessor processes a low-speed digital signal transmitted from the co-packaged integrated optoelectronic module to the outside, monitors operation of the co-packaged integrated optoelectronic module, and performs initialization of the co-packaged integrated optoelectronic module.