Active-Bridge Co-Packaged Photonic Transceiver for Pin-Count Limits
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Solution Overview
Problem
Legacy microelectronic packages face challenges in supporting increased off-package I/O bandwidth due to limitations in electrical signaling reach and power, as well as difficulties in sustaining high pin counts due to cost and integration concerns.
Innovation Solution
The integration of co-packaged optics alongside a processor or active die within the microelectronic package, combined with an active bridge, which provides improved power, bandwidth, and compact form factor benefits, while addressing area, power, and size constraints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If electrical signaling is used to increase off-package I/O bandwidth, then signaling speed and pin count can be increased, but the reach and power capabilities are limited
Solution Approach 1:
The patent replaces electrical signaling with optical signaling by integrating a photonic transceiver. The photonic transceiver converts electrical signals to optical signals for transmission, eliminating the need for high pin counts and overcoming electrical signaling limitations in reach and power capability while maintaining compact form factor through co-packaging
Solution Approach 2:
The patent merges the photonic transceiver with the active die in a co-packaged configuration, integrating optical communication capabilities directly into the microelectronic package. This consolidation eliminates the need for separate electrical interconnects and reduces overall package complexity while enhancing power and bandwidth capabilities
2Productivity
If pin count is increased to support higher bandwidth, then I/O bandwidth can be increased, but cost and integration become difficult to sustain
Solution Approach 1:
The patent substitutes optical signaling for electrical signaling, replacing numerous electrical pins with a smaller number of optical interconnects. The photonic transceiver handles high bandwidth communication through optical channels, dramatically reducing the required pin count and simplifying package integration while maintaining high I/O bandwidth
Solution Approach 2:
The patent transitions from electrical domain to optical domain for signal transmission. By using photonic transceivers that operate in the optical spectrum rather than electrical domain, the system achieves higher bandwidth with fewer physical interconnects, fundamentally changing the dimension of signal transmission
3Power
If co-packaged optics are integrated alongside active die, then power and bandwidth capabilities are enhanced, but package area and size constraints must be addressed
Solution Approach 1:
The patent combines the photonic transceiver and active die in a co-packaged configuration where both components share the same package substrate. This merging allows optical communication capabilities to be integrated alongside the active die without requiring separate packaging, enhancing power and bandwidth while minimizing additional package area through shared structural elements
Solution Approach 2:
The patent implements a nested configuration where the photonic transceiver is integrated within the same package footprint as the active die. The co-packaged design allows one component to be positioned adjacent to or partially overlapping with the other in the package layout, effectively nesting optical and electronic functions within a compact area
Data Source
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AI summary
Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.