Co-Packaged Power Converter Dies for Multi-Voltage Integration
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Solution Overview
Problem
Existing power converter technologies face challenges in achieving efficient power conversion with multiple voltage ratings while minimizing packaging costs and mask count.
Innovation Solution
The hybrid (co-packaged) approach integrates lateral double-diffused metal-oxide-semiconductor (LDMOS) field effect transistor devices with a power converter controller, allowing for different voltage ratings on a single wafer without increasing the mask count.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a hybrid (co-packaged) approach is used to integrate lateral LDMOS devices with controller, then packaging costs are reduced and multiple voltage ratings are enabled, but device complexity increases due to co-packaging multiple integrated circuit dies
Solution Approach 1:
The power converter is divided into multiple separate integrated circuit dies: a first die containing lateral LDMOS switches and capacitors, a second die containing the controller circuit, and a third die containing additional switches and capacitors. This segmentation allows each die to be optimized independently for its specific function while enabling cost-effective manufacturing through specialized fabrication processes for each die type.
Solution Approach 2:
Multiple integrated circuit dies are co-packaged within a single package structure, with each die containing sub-circuits (switches, capacitors, controller logic). The nested arrangement allows hierarchical integration where functional blocks are contained within dies, which are in turn contained within the overall package, achieving compact integration while maintaining manufacturing efficiency.
2Area of stationary object
If lateral LDMOS devices are used in the first integrated circuit die, then area is reduced compared to vertical devices, but isolation complexity increases due to the need for deep isolation trenches
Solution Approach 1:
Isolation trenches are implemented only in specific local regions where lateral LDMOS devices require electrical isolation, rather than applying uniform isolation across the entire die. The trenches extend to the substrate and are filled with electrically isolating material precisely where needed to separate adjacent devices, minimizing the overall isolation structure complexity while achieving effective device isolation.
Solution Approach 2:
Replica devices are used to model and characterize the electrical behavior of the main LDMOS devices. These replica structures allow for optimization of isolation techniques and device performance without requiring complex isolation for every single device, as the replica can represent multiple similar devices' behavior.
3Adaptability or versatility
If multiple integrated circuit dies are co-packaged, then versatility is improved by enabling different voltage ratings, but manufacturing complexity increases due to multiple fabrication processes
Solution Approach 1:
The co-packaged structure provides a universal platform that can accommodate multiple integrated circuit dies with different voltage ratings and functional requirements. The package structure itself is designed to be versatile, accepting various die types (lateral LDMOS, vertical devices, controller circuits) and enabling the same physical package to deliver multiple voltage rating configurations depending on which dies are integrated.
Solution Approach 2:
Different integrated circuit dies are fabricated using appropriate fabrication processes optimized for their specific requirements. By allowing parameter changes in the fabrication approach for each die type while maintaining a unified package structure, the system achieves versatility in voltage ratings without requiring a single complex fabrication process for all components.
Data Source
AI summary
Disclosed embodiments may include systems, devices, processes, and methods for fabricating and packaging power converters on an integrated circuit. In some embodiments, a power converter device may be processed and packaged using a hybrid (co-packaged) approach. The power converter includes a first integrated circuit die with a plurality of first switches and a plurality of second switches. The power converter further includes a second integrated circuit die including a controller circuit that is electrically coupled to control switching of the plurality of first switches and the plurality of second switches. The power converter may include additional integrated circuit dies coupled to the controller circuit. The plurality of first switches and the plurality of second switches may each include vertical double-diffused metal-oxide semiconductor field effect transistors. The plurality of first switches and the plurality of second switches may each include lateral double-diffused metal-oxide semiconductor field effect transistors.