Coplanar Bump Contact Geometry for Mixed-Size Solder Joints
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Solution Overview
Problem
Conventional semiconductor device packages face challenges in achieving co-planarity between solder bumps of varying sizes, leading to misalignment and increased likelihood of electrical connection failure under stress, as they are not robust enough to withstand shipping and operational stresses.
Innovation Solution
The use of ring-shape and cylindrical conductive structures on a semiconductor die, with corresponding ring-shape and solder ball solder portions, ensures that all points furthest from the substrate are co-planar, maintaining consistent standoff height and enhancing robustness of electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If solder bumps of various sizes are used to couple semiconductor die, then the functionality and complexity of semiconductor device packages can be increased, but co-planarity between solder bumps of different sizes cannot be achieved
Solution Approach 1:
The patent applies local quality by providing different conductive structure configurations (ring-shaped vs. solid cylindrical) at different locations on the die. Each conductive structure type has specifically designed dimensions (outer diameter, inner diameter, height) tailored to its location and function, allowing varying solder bump sizes while maintaining co-planarity through precise local geometric control
Solution Approach 2:
The patent utilizes parameter changes by systematically varying the dimensions of conductive structures (diameters, heights, wall thicknesses) to compensate for differences in solder bump sizes. By adjusting these geometric parameters, the patent ensures that solder bumps of different sizes achieve co-planar tops, resolving the contradiction between versatility and manufacturing precision
2Adaptability or versatility
If solder bumps of various sizes are used, then different electrical connection requirements can be met, but misalignment and angle issues occur during mounting
Solution Approach 1:
The patent applies equipotentiality by ensuring all solder bump tops reach the same height (co-planarity) despite varying sizes and conductive structure configurations. This creates an equipotential mounting surface that prevents angular misalignment during die attachment, allowing diverse electrical connection requirements to be met without compromising alignment precision
3Ease of manufacture
If conventional solder portions are used, then manufacturing is simpler, but robustness against stresses and strains during shipping and operation is insufficient
Solution Approach 1:
The patent applies local quality by providing different conductive structure configurations (ring-shaped with varying wall thicknesses, solid cylindrical) at different locations on the die. Each configuration is optimized for local stress conditions, with thicker structures at high-stress locations, thereby enhancing overall robustness while maintaining manufacturing feasibility through standardized fabrication processes
4Manufacturing precision
If all solder bumps are made the same size, then co-planarity is achieved, but the ability to perform complex functions is limited
Solution Approach 1:
The patent applies asymmetry by intentionally designing conductive structures with different geometries (ring-shaped versus solid cylindrical) and varying dimensions (diameters, heights, wall thicknesses) at different locations on the die. This asymmetric configuration enables diverse solder bump sizes for complex functions while maintaining co-planarity through precise geometric control, resolving the contradiction between uniformity and versatility
Data Source
AI summary
A die including a first contact with a first shape (e.g., ring-shaped) and a second contact with a second shape (e.g., cylindrical shaped) different from the first shape. The first contact has an opening that extends through a central region of a surface of the first contact. A first solder portion is coupled to the surface of the first contact and the first solder portion has the first shape. A second solder portion is coupled to a surface of the second contact and the second solder portion has the second shape. The first solder portion and the second solder portion both have respective points furthest away from a substrate of the die. These respective points of the first solder portion and the second solder portion are co-planar with each other such that a standoff height of the die remains consistent when coupled to a PCB or an electronic component.