Package Substrate with Embedded Circuit and Coplanar Dielectric
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing package substrate technology has a high thickness due to thick dielectric material, which occupies significant height space and hinders the advancement of package density in the semiconductor industry, as the dielectric material above the circuit is thicker than the circuit itself.
Innovation Solution
The package substrate design embeds circuits within dielectric materials of equal thickness, allowing for a thinner total thickness and higher density packaging by ensuring the circuit and dielectric material thicknesses are equal, with metal vias electrically coupling neighboring layers and redistributing layers configured to optimize density and connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If thick dielectric material is used to embed circuits, then circuit embedding is achieved, but total substrate thickness increases and package density decreases
Solution Approach 1:
The patent changes the thickness parameter of the dielectric material to be equal to the circuit thickness, rather than using significantly thicker dielectric material as in conventional designs. This parameter change directly reduces the total substrate thickness while maintaining circuit embedding functionality, thereby improving package density.
Solution Approach 2:
The patent extracts and eliminates the excess dielectric material that extends above the circuit surfaces. By removing this unnecessary thick dielectric layer and replacing it with a thin conformal dielectric layer, the substrate thickness is reduced without compromising circuit functionality, thus enhancing package density.
2Reliability
If thick dielectric material is used above circuit surfaces, then circuit protection is provided, but height space is occupied and spatial efficiency is reduced
Solution Approach 1:
The patent employs a thin conformal dielectric layer that conforms to the circuit surfaces rather than using a thick planar dielectric layer. This thin film approach provides necessary circuit protection and insulation while occupying minimal height space, thereby improving spatial efficiency and enabling higher package density.
Data Source
AI summary
A package substrate with embedded circuit is disclosed. The package substrate comprises a redistribution layer, the redistribution layer comprises a plurality of circuits, each circuit of the plurality of circuits runs with a top surface coplanar with a top surface of the dielectric material.