Coplanar Heat Pipe Base Structure for Better Thermal Contact
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Solution Overview
Problem
The uneven surfaces of heat pipes and bases in contact with heat sinks hinder the improvement of heat dissipation efficiency in electronic products with high-speed, high-frequency, and small-size components.
Innovation Solution
A heat dissipation device with a thermally-conductive base and heat pipes, where the heat pipes are arranged in accommodation holes and mechanically processed to achieve coplanar connections with the base surfaces, enhancing thermal contact and incorporating a heat exchanger and thermally-conductive layer for improved heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If heat pipes are disposed on a base that is in thermal contact with a heat sink, then the heat pipe may be in thermal contact with the heat sink along with the base for increasing the heat conduction efficiency, but the surfaces of the heat pipes and the base that are in contact with the heat sink are uneven, making heat dissipation efficiency difficult to improve
Solution Approach 1:
The patent applies preliminary action by incorporating a flattening process during the heat pipe manufacturing stage. The heat pipes are pre-flattened to match the base surface geometry before assembly, ensuring coplanar contact surfaces with the heat sink. This preliminary preparation eliminates the need for complex post-assembly adjustments and guarantees optimal thermal contact from the outset.
Solution Approach 2:
The patent employs parameter changes by modifying the geometric parameters of the heat pipes through controlled flattening. The curvature and dimensional parameters of the heat pipe surfaces are adjusted to match the base surface profile, transforming the original cylindrical geometry into a coplanar configuration that ensures uniform thermal contact across the entire contact interface.
2Power
If electronic components are arranged closer to achieve high speed, high frequency and small size, then the power and functionality of electronic products are improved, but the heat dissipation efficiency becomes more critical and harder to maintain
Solution Approach 1:
The patent applies merging by integrating multiple heat dissipation functions into a unified structure. The base and heat pipes are combined into a single thermally-conductive assembly where heat can be dissipated through multiple pathways simultaneously - through the base and through the heat pipes - thereby enhancing overall heat dissipation efficiency to support higher power electronic components.
Solution Approach 2:
The patent employs another dimension by transitioning from a single-plane heat dissipation approach to a multi-dimensional heat transfer system. Heat pipes are arranged in specific spatial patterns (e.g., staggered or grid configurations) that create multiple thermal conduction pathways in different directions, enabling more efficient heat removal from high-power components through three-dimensional heat distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coplanar connections between heat pipes and base surfaces enhance heat conduction efficiency, leading to improved heat dissipation performance in electronic products.
Implementation Method 1
the heat pipe may be in thermal contact with the heat sink along with the base for increasing the heat conduction efficiency
Implementation Method 2
The first surface and the heat dissipation surface are directly connected to one another and substantially coplanar
Data Source
AI summary
A heat dissipation device includes a thermally-conductive base that defines a heat absorbing surface and a heat dissipation surface opposite to the heat absorbing surface. The thermally-conductive base includes a plurality of accommodation holes extending between the heat absorbing surface and the heat dissipation surface. The heat dissipation device further includes a plurality of heat pipes each being disposed within a respective accommodation hole. Each of the heat pipes includes a first surface and a second surface that faces away from the first surface. The first surface and the heat dissipation surface being directly connected to each other and are substantially coplanar. The heat absorbing surface includes a thermal contact region configured for direct thermal engagement with the heat source and a peripheral region extending beyond the thermal contact region. The heat pipes distributed between the thermal contact region and the peripheral region in unequal numbers.