Co-planar Heat Spreading Substrate for High-Power Semiconductor Thermal Management
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Solution Overview
Problem
Conventional mounting and heat sinking methods for high-power semiconductor devices, such as LEDs and RF devices, are ineffective in managing heat due to the poor thermal conductivity of their substrates, like sapphire or GaAs, leading to inefficient heat removal and potential device overheating.
Innovation Solution
A heat spreading substrate system comprising a conductive layer, an insulating layer, and a thermally conductive layer, where the layers are configured to be co-planar and have a wider surface area than height, allowing for efficient heat dissipation and electrical connectivity, using rolled materials that are compatible with existing integrated circuit design and manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional mounting and heat sinking methods are used on substrates like sapphire or GaAs, then the devices can be mounted and electrically connected, but heat removal is inefficient leading to overheating
Solution Approach 1:
The patent applies composite materials by creating a layered structure combining electrically conductive material (for electrical connectivity) with thermally conductive material (for heat dissipation). This composite approach allows the substrate to simultaneously provide both electrical and thermal functions that single materials like sapphire or GaAs cannot achieve effectively.
Solution Approach 2:
The patent makes the substrate multi-functional by integrating both electrical conduction and thermal conduction capabilities into a single substrate structure. The first substrate portion provides electrical connectivity while the second substrate portion provides thermal management, allowing one component to serve multiple critical functions.
2Temperature
If the substrate width is increased to improve heat spreading, then thermal management improves, but the substrate height also increases violating co-planarity requirements
Solution Approach 1:
The patent resolves the contradiction by transitioning from a single-layer thick substrate to a multi-layer stacked structure. This dimensional change allows heat spreading to occur across the wide surface area of multiple thin layers rather than requiring a single tall layer, thus maintaining co-planarity while achieving effective heat dissipation.
Solution Approach 2:
The patent segments the substrate into multiple thin layers (first substrate portion and second substrate portion) stacked together. This segmentation allows each layer to remain thin and co-planar while the collective structure provides extensive heat spreading area through the combination of multiple layers.
3Ease of manufacture
If rolled materials are used to improve manufacturing compatibility, then ease of manufacture increases, but material selection may be limited
Solution Approach 1:
The patent applies parameter changes by specifying that the conductive and insulating layers can be made from rolled materials with specific thickness ranges and material properties. This allows the use of commercially available rolled materials that are compatible with existing manufacturing processes while still achieving the required electrical and thermal performance characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively spreads heat across a wider surface area, improving thermal management and reducing the risk of overheating in high-power semiconductor devices while maintaining electrical functionality, thus enhancing the reliability and performance of these devices.
Implementation Method 1
a thermally conductive layer disposed in contact with the first insulating layer, opposite the first conductive layer
Data Source
AI summary
Heat spreading substrate. In accordance with an embodiment of the present invention, an apparatus includes a thermally conductive, electrically insulating regular solid, a first electrically conductive coating mechanically coupled to a first edge of the regular solid and a second electrically conductive coating mechanically coupled to a second edge of the regular solid. The first and the second electrically conductive coatings are electrically isolated from one another and the faces of the first electrically conductive coating, the second electrically conductive coating and the regular solid are substantially co-planar. The primary and secondary surfaces of the regular solid may be free of electrically conductive materials.