Coplanar Image Sensor Module with Reinforcing Frame
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional dual camera systems in smartphones suffer from inferior coplanarity of image sensors, leading to suboptimal image clarity and stability.
Innovation Solution
An image capturing module comprising a circuit substrate, a structure reinforcing frame, image sensing chips, an adhesive body, and lens modules, where the image sensing chips are coplanarly disposed on a datum plane with the adhesive body connecting them to the reinforcing frame, ensuring optimal coplanarity and alignment, and the module includes additional features like heat dissipation substrates and auxiliary frames for enhanced stability and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If image sensors are integrated into portable electronic devices with small size, then device size is reduced, but coplanarity of image sensors deteriorates
Solution Approach 1:
The patent divides the mounting structure into multiple components: a circuit substrate, a reinforcing frame with positioning structures, and adhesive bodies with specific geometric features. This segmentation allows each component to be optimized independently for both size and coplanarity, resolving the contradiction between miniaturization and precision alignment.
Solution Approach 2:
The patent introduces localized geometric features at critical positions: convex portions on the circuit substrate, corresponding concave portions on the reinforcing frame, and matching convex portions on the adhesive bodies. These local quality enhancements provide precise positioning and maintain coplanarity without increasing overall device volume.
2Manufacturing precision
If adhesive body connects image sensing chip to reinforcing frame, then coplanarity is improved, but manufacturing complexity increases
Solution Approach 1:
The adhesive bodies are designed with self-aligning geometric features: convex portions that fit into concave portions on the reinforcing frame, and matching features on the circuit substrate. This self-service design allows the adhesive bodies to automatically position themselves during assembly, achieving precise coplanarity without complex external alignment procedures.
3Manufacturing precision
If multiple image sensing chips are coplanarly disposed, then image clarity is improved, but structural complexity increases
Solution Approach 1:
The reinforcing frame serves multiple functions simultaneously: it provides mechanical support for the circuit substrate, contains positioning structures for precise chip alignment, and acts as a reference plane for coplanarity. This multi-functionality achieves precise coplanar disposition of multiple image sensing chips without proportionally increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Maintains the optimum coplanarity of image sensing chips, enhancing image clarity and heat dissipation efficiency, while providing structural rigidity to improve the overall performance of the image capturing module.
Implementation Method 1
The adhesive body is disposed on the structure reinforcing frame, and the adhesive body is connected between each image sensing chip and the structure reinforcing frame
Implementation Method 2
The structure reinforcing frame has a plurality of convex bodies opposite to the circuit substrate and passing through the adhesive body, and all of the image sensing chips, the adhesive body, and the convex bodies are coplanarly disposed on the heat dissipation substrate
Data Source
AI summary
A portable electronic device and an image capturing module thereof are disclosed. The image capturing module includes a circuit substrate, a structure reinforcing frame, a plurality of image sensing chips, an adhesive body, and a plurality of lens modules. The circuit substrate has a plurality of first passing openings. The structure reinforcing frame is disposed on the circuit substrate, and the structure reinforcing frame has a plurality of second passing openings respectively communicated with the first passing openings. The image sensing chips are disposed on the circuit substrate and electrically connected with the circuit substrate, and the image sensing chips are coplanarly disposed on a datum plane. The adhesive body is connected between each image sensing chip and the structure reinforcing frame. The lens modules are disposed on the circuit substrate, and the lens modules respectively correspond to the image sensing chips.