Coplanar PCB Expansion Connectors for Server Space Efficiency

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Modern server computer hardware faces challenges in efficient space utilization and thermal regulation due to conventional expansion connector designs that increase the spatial volume and limit flexibility in configuring components within modular server systems.

Innovation Solution

The design of a printed circuit board (motherboard) with PCIe lanes running to both sides, allowing for rotatable expansion connectors on the outer edges, which positions expansion devices coplanarly, reducing vertical space usage and enabling taller heat sinks for improved thermal regulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If expansion connectors are mounted on conventional motherboards, then connectivity functionality is provided, but the spatial volume increases and flexibility in configuring components is limited

Engineering Contradiction:
Improveflexibility in configuring componentsVSAvoidspatial volume
Core Design Contradiction:
Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The patent transitions from conventional perpendicular mounting to coplanar mounting, where expansion connectors and expansion devices lie in the same plane as the motherboard. This dimensional change reduces vertical space requirements and allows for more flexible configuration of components within the server rack, directly addressing the contradiction between spatial volume and configurability

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If conventional expansion connector designs are used, then standard connectivity is achieved, but thermal regulation becomes difficult due to increased height

Engineering Contradiction:
Improvethermal regulationVSAvoidoverall height
Core Design Contradiction:
TemperatureVSLength of moving object

Solution Approach 1:

By changing the mounting orientation from perpendicular to coplanar, the patent reduces the vertical height of the assembly. This allows sufficient space for taller heat sinks to be installed, improving thermal regulation capabilities while maintaining standard connectivity functionality

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Area of stationary object

If modular hardware building blocks are used, then space efficiency is improved, but the number of expansion connectors increases the need for efficient space utilization

Engineering Contradiction:
Improvespace utilizationVSAvoidnumber of expansion connectors
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent merges multiple expansion connectors onto a single coplanar motherboard design, allowing multiple connectors to be efficiently arranged in the same plane. This consolidation approach maximizes space utilization within modular server racks while accommodating an increased number of expansion connectors through optimized coplanar layout

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS10956353B1Connector configurations for printed circuit boards
Publication Date: 2021.03.23 AMAZON TECH INC
  • US10956353B1 patent drawing
  • US10956353B1 patent drawing
  • US10956353B1 patent drawing

AI summary

A printed circuit board (PCB) may be provided that includes a plurality of expansion device connectors mounted to at least two outer edges of the PCB. Each of the expansion device connectors may include a slot aligned in a same plane as the PCB. The slot may be positioned to connect to an expansion device such as to align the expansion device in the same plane as the PCB. Thus, the expansion card may be communicatively connected to the PCB via the expansion card connector. As the PCB includes expansion device connectors on at least two outer edges, the PCB may be positioned in at least two orientations to provide a greater number of expansion device configurations than realized in some PCBs.