Co-Planar PCB Interconnection for High-Speed Signal Integrity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing connectors, such as M.2 connectors, introduce signal integrity loss for high-speed input/output signals and increase the overall size of the system, while alternative solutions like retimers or low-loss PCB materials increase costs, and solder-down approaches add height and complicate scalability.
Innovation Solution
The implementation of co-planar board-to-board connection mechanisms that eliminate the need for traditional connectors, using interlocking fins and recesses for precise alignment and electrical connections, such as gold finger traces or PCBeam™ connectors, to maintain signal integrity and reduce system size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional connectors (e.g., M.2 connectors) are used to interconnect circuit boards, then electrical connections are established, but signal integrity loss occurs for high-speed input/output signals
Solution Approach 1:
The patent extracts and eliminates the traditional connector component entirely from the circuit board interconnection system. By removing the connector and replacing it with direct board-to-board connections through matching patterns and interlocking structures, signal integrity is improved by eliminating the connector as a source of signal loss, while device complexity is reduced by removing the connector assembly.
Solution Approach 2:
The patent merges the electrical connection function directly into the circuit board structure itself. The connection patterns, interlocking features, and electrical contacts are integrated into the board design, eliminating the need for separate connector components. This merging improves signal integrity by creating a more direct transmission path and reduces device complexity by consolidating functions.
2Reliability
If traditional connectors (e.g., M.2 connectors) are used to interconnect circuit boards, then electrical connections are established, but the overall size of the system increases
Solution Approach 1:
The connector component is extracted and removed from the system. By eliminating the connector, the space it occupied in the system assembly is freed up, directly reducing the overall system size while maintaining electrical connection functionality through the integrated board-to-board connection patterns.
Solution Approach 2:
The electrical connection function is merged into the circuit board structure itself, eliminating the need for separate connector components that occupy additional space. This integration reduces the overall system footprint while maintaining reliable electrical connections through the direct board-to-board interface.
3Reliability
If retimers or low-loss PCB materials are used to address signal integrity loss, then signal integrity is improved, but the cost of the system increases
Solution Approach 1:
The patent removes the need for expensive signal integrity enhancement components such as retimers and specialized low-loss PCB materials. By eliminating the connector that causes signal integrity issues in the first place, the system avoids the additional cost of these corrective components while maintaining signal quality through the direct connection architecture.
Solution Approach 2:
The connection patterns and interlocking structures are designed into the circuit boards during manufacturing, preventing signal integrity issues before they occur. This preliminary design approach eliminates the need for expensive corrective measures like retimers or specialized materials, achieving signal integrity at a lower cost through proactive design rather than reactive correction.
4Area of stationary object
If solder-down approaches are used to connect different boards, then the area is reduced, but the height of the system increases and scalability is compromised
Solution Approach 1:
The patent segments the connection function into modular board-to-board interfaces with standardized connection patterns and interlocking structures. This segmentation allows different board sizes and configurations to be connected using the same interface methodology, maintaining scalability while achieving compact area utilization through direct connections without requiring solder-down processes.
Solution Approach 2:
The connection patterns and interlocking structures are designed as universal interfaces that can accommodate different board sizes, shapes, and configurations. This universality maintains scalability and adaptability while achieving reduced board area through direct connections, eliminating the need for solder-down approaches that compromise height and scalability.
Data Source
AI summary
In one embodiment, a system includes a first circuit defining recesses along an edge of the first circuit board, and a second circuit board defining fins extending from at least one outer edge of the second circuit board. The fins of the second circuit board are positioned within the recesses of the second circuit board to connect the circuit boards in a co-planar manner. The fins and recesses may be shaped to provide an interlocking connection of the first and second circuit boards in the co-planar direction.