Multi-Die Package With Coplanar Solder Balls
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Solution Overview
Problem
Existing multi-die IC packages face challenges in achieving a small form factor and low cost, as they often require complex routing of connections through the package substrate, increasing size and manufacturing complexity.
Innovation Solution
The proposed solution involves a multi-die package design where the first and second dies are mounted on opposite sides of a package substrate with solder balls that are coplanar, using through mold interconnects to connect the dies and substrate, allowing direct solder ball connections that reduce footprint and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex routing through package substrate is used to connect dies, then connection reliability is improved, but package footprint area increases and manufacturing complexity increases
Solution Approach 1:
The patent transitions from planar routing through the package substrate to three-dimensional vertical stacking of dies. Multiple dies are stacked in the z-direction and connected via through-mold interconnects (TMIs), converting two-dimensional routing into three-dimensional vertical interconnection. This dimensional change reduces the horizontal footprint while maintaining connection reliability through direct vertical pathways.
Solution Approach 2:
The patent introduces through-mold interconnects (TMIs) as intermediary structures that directly connect corresponding pads on adjacent dies. These TMIs act as mediators, eliminating the need for complex substrate routing by providing direct conductive pathways through the mold compound, thereby reducing footprint while ensuring reliable connections.
2Reliability
If complex routing through package substrate is used to connect dies, then connection reliability is improved, but device complexity increases
Solution Approach 1:
The patent simplifies manufacturing by moving from complex planar substrate routing to straightforward vertical stacking. The through-mold interconnects are formed by simple vertical vias through the mold compound, eliminating the need for complex multi-layer substrate routing processes. This dimensional simplification reduces manufacturing steps and device complexity while maintaining connection reliability.
Solution Approach 2:
Instead of routing connections through the substrate plane, the patent inverts the approach by routing connections vertically through the mold compound between stacked dies. This inversion of the routing paradigm simplifies the interconnection structure and reduces manufacturing complexity by using direct vertical pathways rather than complex planar traces.
3Adaptability or versatility
If traditional multi-die package design is used, then design flexibility is maintained, but form factor increases
Solution Approach 1:
The patent enables compact form factors by stacking dies vertically in the z-direction rather than arranging them horizontally in the x-y plane. This three-dimensional stacking approach maintains design flexibility through the ability to stack different die types and configurations while dramatically reducing the horizontal footprint area.
Solution Approach 2:
The patent implements a nested arrangement where multiple dies are stacked one on top of another, with each die nested within the vertical space occupied by the package. This nesting in the vertical dimension allows multiple functional blocks to be integrated within a compact footprint, maintaining design flexibility while minimizing the horizontal area.
Data Source
AI summary
Embodiments herein may relate to a package that includes a package substrate with a first die on a first side of the package substrate and a second die on a second side of the package substrate. Solder balls may be coupled with the second side of the package substrate and the second die such that the solder balls are approximately coplanar. Other embodiments may be described and/or claimed.