Power Module Terminal Layout for Stray Inductance Reduction
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Solution Overview
Problem
Parasitic stray inductance in semiconductor device modules, particularly in power modules, adversely affects performance due to magnetic fields generated by high currents, leading to inefficiencies and reduced functionality.
Innovation Solution
The implementation of multiple positive power supply terminals laterally disposed from a negative power supply terminal, with parallel and coplanar current paths, and internal routing of metal layers to intersect and overlap with the negative power supply terminal, reducing mutual interference of magnetic fields and stray inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high currents are conducted by power semiconductor devices, then power delivery capability is improved, but parasitic stray inductance increases due to magnetic field interference
Solution Approach 1:
The patent applies asymmetry by positioning the negative power supply terminal between two positive power supply terminals in a non-uniform configuration. The connection tabs are arranged asymmetrically on the substrate surface, creating unequal current path lengths that deliberately balance the magnetic fields generated by high currents, thereby reducing parasitic stray inductance while maintaining high power delivery capability
Solution Approach 2:
The patent implements the counterweight principle by arranging positive and negative power supply terminals in alternating positions. The magnetic fields generated by currents in opposite directions from adjacent terminals counterbalance each other, with the negative terminal acting as a counterweight to the positive terminals, reducing net magnetic field interference and parasitic inductance
2Loss of energy
If multiple power supply terminals are used to reduce stray inductance, then electrical efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple power supply terminals (at least one positive and one negative terminal) into a unified terminal structure where connection tabs are integrated onto the substrate surface. This combining approach allows the terminals to work together to reduce stray inductance through their collective magnetic field interaction, improving electrical efficiency while the integrated design keeps complexity manageable
Solution Approach 2:
The patent transitions from traditional three-dimensional terminal arrangements to a two-dimensional planar configuration on the substrate surface. The connection tabs are disposed in a plane on the substrate, using lateral positioning rather than vertical stacking to achieve terminal separation and magnetic field balancing, thereby reducing complexity while maintaining efficiency benefits
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves a 15-50% reduction in stray inductance, improving electrical efficiency and performance by balancing current densities and canceling magnetic fields, thereby enhancing the overall functionality of the semiconductor device modules.
Implementation Method 1
parasitic (stray) inductance resulting from magnetic fields associated with high currents conducted by those power semiconductor devices
Implementation Method 2
reducing mutual interference of magnetic fields and stray inductance
Data Source
AI summary
In general aspect, a module can include a substrate having a semiconductor circuit implemented thereon, and a negative power supply terminal electrically coupled with the semiconductor circuit via the substrate. The negative power supply terminal includes a connection tab arranged in a first plane. The module also includes a first positive power supply terminal electrically and a second positive power supply terminal that are coupled with the semiconductor circuit via the substrate. The first positive power supply terminal being laterally disposed from the negative power supply terminal, and including a connection tab arranged in the first plane. The second positive power supply terminal is laterally disposed from the negative power supply terminal and arranged in the first plane, such that the negative power supply terminal is disposed between the first positive power supply terminal and the second positive power supply terminal.