Coplanar Waveguide Transition with Air Trenches
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Solution Overview
Problem
Wire bonding in high-frequency electronic packaging introduces parasitic inductance and occupies physical space, hindering performance and requiring more compact and efficient connectivity solutions for semiconductor chips and substrates.
Innovation Solution
A coplanar waveguide transition with vias and air trenches through a substrate, enabling seamless electrical coupling between coplanar waveguides on both sides, providing a compact and high-performance transition with wide bandwidth and impedance matching capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to electrically connect semiconductor chips to substrates, then electrical connectivity is achieved, but parasitic inductance increases and performance deteriorates at millimeter-wave frequencies
Solution Approach 1:
The patent removes the wire bond component entirely from the electrical connection path. Instead of using wire bonds to connect chips to substrates, the invention uses coplanar waveguides with air trenches and vias to create a direct electrical pathway through the substrate, extracting the harmful wire bond element from the system.
Solution Approach 2:
The patent introduces coplanar waveguides as intermediary structures that provide a controlled impedance pathway for electrical signals. The air trenches act as intermediaries to manage electromagnetic field distribution and reduce parasitic effects, while vias serve as intermediary connection points between different layers.
2Reliability
If wire bonds are used for electrical connection, then connectivity is established, but physical space is consumed by the wire length between chip and package substrate
Solution Approach 1:
The patent transitions from a planar wire bond connection to a three-dimensional structure using vias that penetrate through the substrate thickness. This vertical dimension allows electrical connection without consuming horizontal package space, as the connection path moves from the plane to the depth of the substrate.
Solution Approach 2:
The invention extracts the electrical connection function from the wire bond and redistributes it through integrated coplanar waveguide structures and vias that are formed within the substrate itself, eliminating the need for external wire bonds that occupy package space.
3Reliability
If conventional waveguide transition structures are used, then electrical coupling is achieved, but operating bandwidth is limited and insertion loss is high
Solution Approach 1:
The patent applies different material properties and structural characteristics to different regions of the waveguide transition. Air trenches are placed in specific locations to control electromagnetic field distribution, while vias are positioned strategically to maintain impedance continuity. This localized optimization enables wide bandwidth operation with low insertion loss.
Solution Approach 2:
The patent creates a composite structure combining coplanar waveguides, air trenches, and metallic vias within the substrate. This composite approach leverages the complementary strengths of each component: the coplanar waveguides provide controlled impedance, the air trenches reduce parasitic effects, and the vias provide vertical connectivity, together achieving superior broadband performance.
Data Source
AI summary
A coplanar waveguide transition includes a substrate, a first coplanar waveguide on a first side of the substrate, and a second coplanar waveguide on a second side of the substrate. The coplanar waveguide transition includes a first, a second, and a third via through the substrate electrically coupling the first coplanar waveguide to the second coplanar waveguide. The coplanar waveguide transition includes voids through the substrate between the first, second, and third vias and edges of the first coplanar waveguide and edges of the second coplanar waveguide.