Coplanar Waveguide Connecting Plate for Optoelectronic Signal Integrity
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Solution Overview
Problem
Existing optoelectronic devices face inefficiencies in high-frequency signal transmission due to wire-bonding, which affects performance and reliability, and require numerous connections that complicate operability.
Innovation Solution
A connecting plate with a high-frequency transmission line and isolation dielectric forms a coplanar waveguide transmission line with the ground, replacing wire-bonding to enhance signal integrity and efficiency, and includes components like chip matching resistors and backlight detectors for impedance matching and feedback control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire-bonding is used to connect high-frequency signal and low-frequency signal, then the connection can be established, but the high-frequency signal transmission efficiency deteriorates and reliability decreases
Solution Approach 1:
The patent merges the high-frequency transmission line and low-frequency signal connection into a single integrated connecting plate structure. The connecting plate combines CPW transmission lines for high-frequency signals with integrated wire-bonding paths for low-frequency signals, eliminating the need for separate connection methods and improving overall system reliability and efficiency.
Solution Approach 2:
The connecting plate serves as an intermediary component between the packaged part and core component. It provides a dedicated interface that supports both high-frequency CPW transmission and low-frequency wire-bonding connections, mediating the signal transmission between different frequency domains and improving overall system performance.
2Adaptability or versatility
If multiple wire-bondings are used to connect packaged part and chip subcarrier, then all signal connections can be established, but the device complexity increases and operability deteriorates
Solution Approach 1:
The patent combines multiple separate wire-bonding connections into a single integrated connecting plate that handles both high-frequency and low-frequency signals. This consolidation reduces the number of discrete connection operations while maintaining comprehensive signal transmission capability.
Solution Approach 2:
The connecting plate is designed as a universal interface that performs multiple functions: it provides CPW transmission for high-frequency signals, accommodates wire-bonding for low-frequency signals, and integrates both connection methods into a single operable component, thereby reducing overall device complexity.
3Ease of manufacture
If air is used as dielectric in wire-bonding, then the connection structure is simple, but the high-frequency signal transmission becomes inefficient
Solution Approach 1:
The patent changes the dielectric parameter from air (in wire-bonding) to a solid dielectric material in the CPW transmission lines on the connecting plate. This parameter change optimizes the transmission characteristics for high-frequency signals while maintaining manufacturing feasibility through standard PCB fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves the integrity and efficiency of high-frequency signal transmission and reduces the complexity of connections, enhancing the overall performance and reliability of optoelectronic devices by integrating multiple functions into a single connecting plate.
Implementation Method 1
an isolation dielectric, located on both sides of the high-frequency transmission line and configured to isolate the high-frequency transmission line and the ground
Implementation Method 2
the high-frequency transmission line and the isolation dielectric form a coplanar waveguide transmission line together with the ground to implement mode field matching
Implementation Method 3
a chip matching resistor, configured to implement impedance matching of the optoelectronic chip
Data Source
AI summary
An optoelectronic device includes a packaged part and a core component. The core component includes a chip subcarrier and an optoelectronic chip. The device also includes a connecting plate that forms a coplanar waveguide transmission line together with the ground through a high-frequency transmission line and an isolation dielectric. The coplanar waveguide transmission line and a low-frequency line are connected to the packaged part and the core component and are configured to transmit a high-frequency signal and a low-frequency signal between the packaged part and the core component.