Coplanar Waveguide Coupler for RF Signal Transmission Through Laminate Windows
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Solution Overview
Problem
Existing laminate window assemblies with embedded radio frequency devices face challenges in communicating signals with external devices without a direct physical connection, as they are embedded between two glass substrates.
Innovation Solution
Incorporating an embedded coplanar waveguide attached to the radio frequency device between the glass substrates and an exterior coplanar waveguide adjacent to the window substrate, allowing electromagnetic coupling to facilitate communication of radio waves through the window without a direct physical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an embedded radio frequency device is disposed between two glass substrates, then the window assembly integrates communication functionality, but the device cannot physically connect to external devices
Solution Approach 1:
The patent introduces coplanar waveguides as intermediary structures that extend from the embedded radio frequency device through the glass substrate to the exterior surface. These waveguides act as mediators that transfer electromagnetic signals without requiring physical penetration or external connectors, thus maintaining the sealed structure while enabling communication functionality.
Solution Approach 2:
The patent replaces traditional mechanical connection methods (such as wires or connectors passing through the glass) with electromagnetic field-based coplanar waveguides. This substitution eliminates the need for physical penetration of the glass substrate while maintaining signal transmission capability, resolving the contradiction between integration and physical connectivity.
2Strength
If the window assembly maintains a sealed laminated structure, then structural integrity is preserved, but signal transmission to external devices is blocked
Solution Approach 1:
The patent transitions the signal transmission path from a three-dimensional space (requiring physical penetration through the glass thickness) to a two-dimensional plane (extending waveguides along the glass surface to the exterior). This dimensional change allows the sealed structure to remain intact while providing signal access at the exterior surface through the coplanar waveguide extensions.
Solution Approach 2:
The patent utilizes the glass substrate itself as a flexible transmission medium for electromagnetic waves. By embedding coplanar waveguides within or on the glass surface, the signal can propagate through the thin film structure without compromising the sealed nature of the laminated window assembly.
3Ease of operation
If coplanar waveguides are embedded within the glass substrates, then physical connection is eliminated, but manufacturing complexity increases
Solution Approach 1:
The patent incorporates the coplanar waveguides during the glass substrate manufacturing process itself, rather than attempting to install them after the window assembly is complete. This preliminary action integrates the waveguide fabrication into the existing glass production workflow, reducing overall manufacturing complexity despite the added feature.
Solution Approach 2:
The patent merges the coplanar waveguide fabrication process with the glass substrate manufacturing process. By combining these two processes into one integrated workflow, the patent reduces the number of separate manufacturing steps and minimizes the overall complexity increase that would result from adding waveguide fabrication as a separate post-processing step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables communication between embedded and external radio frequency devices without the need for a direct physical connection, enhancing the functionality of laminate window assemblies by allowing radio frequency signals to be transmitted through the window substrate.
Implementation Method 1
An exterior coplanar waveguide is disposed adjacent the second side surface of the first window substrate, and is disposed opposite the embedded coplanar waveguide for communicating electromagnetic waves therebetween
Data Source
AI summary
A window assembly includes a first radio frequency device disposed between a first window substrate and a second window substrate. An embedded coplanar waveguide is disposed between the first window substrate and the second window substrate, and is attached to the first radio frequency device. An exterior coplanar waveguide is disposed adjacent an exterior side surface of the first window substrate, and is disposed opposite the embedded coplanar waveguide for communicating electromagnetic waves therebetween. A printed circuit board is attached to and interconnects the exterior coplanar waveguide and a radio frequency cable connector. The radio frequency cable connector is configured for connection to a second radio frequency device. An adhesive layer bonds the printed circuit board to the exterior side surface of the first window substrate.