Conductor-Backed Coplanar Waveguide Feed for mm-Wave Antenna Packages
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Solution Overview
Problem
Existing integrated antenna systems in packaged electronic devices face challenges in achieving improved transmission line and packaged transitions for better antenna system performance, particularly in mm-wave communications.
Innovation Solution
A multilevel package substrate with a conductor backed coplanar waveguide transmission line feed is integrated, featuring a semiconductor die mounted to a multilevel package substrate with conductive pads and terminals, and a conductor backed coplanar waveguide transmission line feed that includes an interconnect and a conductor, providing an electromagnetic feed line for high frequency signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional transmission line structures are used in packaged electronic devices, then device integration is achieved, but antenna system performance (bandwidth and gain) is insufficient
Solution Approach 1:
The patent transitions from conventional two-dimensional planar transmission lines to a three-dimensional multilevel structure with conductors at different vertical levels (first level interconnect, second level ground plane, third level conductor). This dimensional change enables the conductor-backed coplanar waveguide configuration that provides both improved antenna performance and controlled impedance characteristics.
Solution Approach 2:
The patent embeds multiple conductive elements within each other in a nested configuration: the first conductive line (signal) is nested between second conductive lines (ground) on the same level, while the third conductive line (ground) is nested on a different vertical level. This nested arrangement creates the conductor-backed coplanar waveguide structure that provides both shielding and impedance control.
2Quantity of substance
If integrated antennas are added to packaged devices, then component density increases, but transmission line performance deteriorates
Solution Approach 1:
The patent carefully controls critical geometric parameters of the multilevel transmission line structure, including conductor widths, spacing between conductive lines, and vertical distances between levels. By optimizing these parameters, the design achieves both high component density and excellent transmission line performance with controlled impedance characteristics.
Solution Approach 2:
The patent employs a composite structure combining multiple dielectric materials with different properties between the conductive levels, allowing optimization of both signal transmission characteristics and spatial utilization. The different dielectric layers enable fine-tuning of electromagnetic field distribution while maintaining compact packaging.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves an integrated antenna-in-package with improved bandwidth and peak gain, supporting mm-wave communications with enhanced directivity and gain in the WR5 and WR8 bands, outperforming existing solutions in terms of bandwidth and efficiency.
Implementation Method 1
a conductor backed coplanar waveguide transmission line feed in the multilevel package substrate... The interconnect includes coplanar first, second, and third conductive lines extending in the first level along the first direction from respective ends to an antenna
Implementation Method 2
The interconnect includes coplanar first, second, and third conductive lines extending in the first level along the first direction from respective ends to an antenna. The second and third conductive lines are spaced apart from opposite sides of the first conductive line along the second direction
Data Source
AI summary
A method of fabricating an electronic device including fabricating a multilevel package substrate with first, second, third, and fourth levels, a semiconductor die mounted to the first level, and fabricating a conductor backed coplanar waveguide transmission line feed with an interconnect and a conductor, the interconnect including coplanar first, second, and third conductive lines extending in the first level along a first direction from respective ends to an antenna, the second and third conductive lines spaced apart from opposite sides of the first conductive line along an orthogonal second direction, and the conductor extending in the third level under the interconnect and under the antenna.