Semicrystalline Copolyamide Adhesive for Low-Pressure Electronic Encapsulation
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Solution Overview
Problem
Existing hot-melt adhesives for encapsulating electronic devices lack properties such as thermal conductivity, low viscosity, good mechanical properties, and adhesion, leading to inefficient and potentially damaging encapsulation processes.
Innovation Solution
A hot-melt adhesive composition comprising semicrystalline aliphatic copolyamides with specific units and fillers, including carbon-based and electrically insulating fillers, providing improved thermal conductivity, low viscosity, and adhesion, suitable for low-pressure encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional hot-melt adhesives are used for encapsulation, then the encapsulation process can be performed, but the thermal conductivity is insufficient and viscosity is too high causing potential damage to fragile parts
Solution Approach 1:
The patent uses a composite material system consisting of a polyamide matrix combined with specific fillers (carbon-based fillers like graphite or carbon black, and electrically insulating fillers like aluminum oxide or silicon oxide) to achieve both improved thermal conductivity and controlled viscosity. The filler content is optimized to balance thermal performance with flow characteristics during encapsulation.
2Manufacturing precision
If high pressure is applied during encapsulation to improve filling, then the encapsulation is more complete, but the fragile parts are damaged
Solution Approach 1:
The patent modifies the rheological parameters of the adhesive by controlling the molecular weight distribution and composition of the polyamide,以及 the filler content and size. This enables the material to achieve complete encapsulation at low pressure through optimized viscosity and flow characteristics, preventing damage to fragile electronic components.
3Strength
If reactive materials are used to improve adhesion, then bonding strength increases, but the reaction time is long reducing productivity
Solution Approach 1:
The patent employs a non-reactive polyamide adhesive system that provides sufficient adhesion through physical bonding and filler reinforcement rather than chemical reactions. This eliminates the need for lengthy curing cycles, enabling rapid encapsulation and significantly improving productivity while maintaining adequate bond strength.
4Stability of the object's composition
If the melting point is increased to improve structural stability, then the material is more stable, but the encapsulation process becomes more difficult and may damage parts
Solution Approach 1:
The patent optimizes the melting point of the polyamide adhesive through selection of specific polyamide types and filler combinations, achieving a balance where the material remains stable during storage and handling but melts at an appropriate temperature for low-pressure encapsulation. This enables easy processing without damaging fragile electronic components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables high productivity, secure, and rapid encapsulation of fragile objects with improved thermal conductivity and adhesion, while maintaining a low melting point to avoid damage to encapsulated parts.
Implementation Method 1
improved thermal conductivity
Implementation Method 2
The material which makes it possible to encapsulate the part is melted
Data Source
AI summary
The invention relates to a hot-melt adhesive composition comprising:i) at least one specific semicrystalline aliphatic copolyamide,ii) at least one filler, the content of carbon atoms of which is between 60% and 100% relative to the number of atoms constituting the filler,the carbon-based filler having a D90 median average particle size ranging from 1 to 400 micrometers,iii) at least one electrically insulating filler chosen from oxides of metals and nitrides,the sum of the contents of carbon-based filler and of electrically insulating filler is between 30% and 75% by weight relative to the total weight of the composition, said fillers having a D90 median average particle size ranging from 1 to 400 micrometers.The invention also relates to a process for the preparation thereof and to the use thereof.