Copolymer Bonding Component for High Temperature Dissimilar Material Adhesion
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Solution Overview
Problem
Bonding dissimilar materials like ceramic and metal in showerheads and electrostatic chucks is challenging due to their different coefficients of thermal expansion, and existing adhesives like PDMS delaminate at high temperatures, while perfluoro elastomers are not compliant enough for effective adhesion.
Innovation Solution
A bonding component comprising a copolymer of organofluorine and organosilicon polymers, formed by mixing and curing solutions to create a film that binds dissimilar materials with enhanced thermal stability and plasma erosion resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If PDMS is used as bonding material, then compliant nature and adhesion are improved, but temperature resistance deteriorates as it delaminates above 150°C
Solution Approach 1:
The patent uses a copolymer bonding material combining organosilicon polymer (PDMS) and organofluorine polymer, merging the compliant adhesive properties of PDMS with the high-temperature stability of organofluorine polymer to achieve both adhesion and temperature resistance
2Temperature
If perfluoro elastomers are used, then temperature resistance and plasma erosion resistance are improved, but compliance and adhesion to dissimilar materials deteriorate
Solution Approach 1:
The patent combines organosilicon polymer (providing compliance and adhesion) with organofluorine polymer (providing temperature and plasma resistance) in a copolymer structure, allowing the material to exhibit both adhesive properties and high-temperature stability
3Adaptability or versatility
If bonding dissimilar materials with different CTEs, then functional integration is improved, but bonding reliability deteriorates due to thermal expansion mismatch
Solution Approach 1:
The patent modifies the bonding material's physical and chemical parameters by creating a copolymer with specific composition ratios (organosilicon polymer 5-50 wt%, organofluorine polymer 50-95 wt%) to optimize both CTE matching and thermal stability for bonding dissimilar materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copolymer bonding component maintains adhesive properties and resistance to temperatures from 120°C to 300°C, providing a compliant and durable bond between dissimilar materials, suitable for high-temperature applications.
Implementation Method 1
a copolymer of the organofluorine polymer and the organosilicon polymer
Implementation Method 2
PDMS tends to form a three dimensional porous network by crosslinking the linear polymer chains of formula I
Implementation Method 3
depositing the copolymer solution onto a body to form a film of the copolymer
Implementation Method 4
curing the film of the copolymer
Implementation Method 5
forming a solid three dimensional porous organosilicon polymer based network
Implementation Method 6
contacting a solution comprising an organofluorine polymer with said surface, wherein the solution penetrates pores in the solid three dimensional porous organosilicon polymer based network
Data Source
AI summary
A method for preparing a bonding component comprises mixing a first solution comprising an organofluorine monomer unit with a second solution comprising an organosilicon monomer unit to form, in-situ, a copolymer solution comprising a copolymer of an organofluorine polymer and an organosilicon polymer based on the organofluorine monomer unit and the organosilicon monomer unit. The method further comprises depositing the copolymer solution onto a body to form a film of the copolymer, and curing the film of the copolymer.