Copolymer Laminate for Low-Dielectric Copper Foil Adhesion
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Solution Overview
Problem
Conventional materials fail to provide a cured product with excellent low dielectric properties and mechanical strength, along with high adhesiveness to metal foils, particularly copper foils, which is essential for high-frequency applications.
Innovation Solution
A laminate comprising a resin layer with an olefin-aromatic vinyl compound-aromatic polyene copolymer, where the copolymer has a specific molecular weight range, aromatic vinyl compound content, and vinyl group content, combined with a metal foil, enhancing adhesion and mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If polyolefins or aromatic vinyl compound polymers are used to achieve low dielectric constant and low dielectric tangent, then excellent low dielectric properties are obtained, but heat resistance is insufficient due to dependence on melting point or glass transition temperature
Solution Approach 1:
The patent uses a copolymer combining olefin segments (for low dielectric properties) and aromatic vinyl compound segments (for heat resistance), creating a composite material that integrates the advantages of both polymer types to achieve both low dielectric loss and high heat resistance simultaneously
Solution Approach 2:
The copolymer structure creates local regions with different properties: olefin segments provide low dielectric constant while aromatic vinyl compound segments provide thermal stability, allowing the material to exhibit both low dielectric loss and high heat resistance in different local regions
2Loss of energy
If fluorine-based resins are used to achieve excellent low dielectric constant, low dielectric loss and heat resistance, then superior electrical and thermal properties are obtained, but device suitability is low due to difficulty in moldability and film formability
Solution Approach 1:
The patent changes the chemical composition parameters by using hydrocarbon-based copolymer instead of fluorine-based resin, and adjusts the molecular structure through copolymerization to achieve comparable dielectric properties with significantly improved moldability and film formability
3Temperature
If post-curable resins such as epoxy resins are used to achieve heat resistance and easy handling, then good thermal properties and processability are obtained, but dielectric constants and dielectric losses are relatively high for high frequency applications
Solution Approach 1:
The patent changes the chemical composition from polar epoxy resin to non-polar hydrocarbon copolymer, fundamentally altering the dielectric parameters to achieve low dielectric loss while maintaining heat resistance through the aromatic vinyl compound segments in the copolymer structure
4Loss of energy
If graft or block copolymer including olefin-based and styrene-based polymer segments is used to achieve low dielectric constant and low dielectric loss, then excellent electrical properties are obtained, but the material has insufficient heat resistance and poor processability due to gel formation
Solution Approach 1:
The copolymer creates local aromatic vinyl compound-rich regions that provide heat resistance while maintaining overall low dielectric properties, with the specific local composition controlled to avoid gel formation while achieving both low dielectric loss and high heat resistance
Solution Approach 2:
The patent optimizes the compositional parameters of the copolymer, specifically controlling the ratio and distribution of olefin and aromatic vinyl compound segments, to achieve the right balance between low dielectric loss and heat resistance while preventing gel network formation that would harm processability
Data Source
AI summary
A laminate has an olefin-aromatic vinyl compound-aromatic polyene copolymer and a metal foil. The number average molecular copolymer weight is between 5000 and 100000; the aromatic vinyl compound monomer is aromatic vinyl compound having between 8 and 20 carbon atoms, and the aromatic vinyl compound monomer unit content is between 10 and 60 mass %; the aromatic polyene is selected having between 5 and 20 carbon atoms and vinyl and/or vinylene groups in the molecule, the content derived from the aromatic polyene unit is between 1.5 and 20 pieces per number average molecular weight; and the olefin is selected having between 2 and 20 carbon atoms, being ethylene alone, or having a mass ratio of α-olefin monomer components other than ethylene to an ethylene monomer component contained in the olefin, of 1/7 or less, and the total monomer units of the olefin, aromatic vinyl compound, and aromatic polyene is 100 mass %.