Copolymer Resin for Flexible Photoresist Thermal Resistance
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Solution Overview
Problem
Existing flexible devices face challenges in achieving high thermal resistance, low dielectricity, and flexibility in their layered elements, which are crucial for their functionality, especially when these elements are not inherently flexible and are sensitive to light, affecting the resolution of photoresist layers.
Innovation Solution
A copolymer composition comprising specific repeating units and a resin composition that includes this copolymer, an initiator, and a crosslinkable monomer, optimized to enhance heat resistance, developing capacity, and flexibility, with precise ratios of components to prevent embrittlement and ensure effective crosslinking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional materials are used for layered elements in flexible devices, then thermal resistance and transmittance can be achieved, but flexibility and resolution of photoresist layers deteriorate
Solution Approach 1:
The patent employs a composite material system consisting of a copolymer resin composed of three specific repeating units (Formulae 1-3), a crosslinkable monomer, and an initiator. This composite formulation achieves high thermal resistance through the polysiloxy groups with aromatic rings in the copolymer, while the crosslinking structure provides both flexibility and high resolution patterning capability, resolving the contradiction between thermal stability and photoresist performance.
Solution Approach 2:
The patent optimizes the molecular composition parameters of the copolymer by controlling the molar ratios of three different repeating units and the types of substituent groups (R1-R5). By adjusting these compositional parameters, the material simultaneously achieves high thermal resistance, flexibility, and photoresist resolution, transforming the trade-off into a multi-parameter optimization problem with a satisfactory solution.
2Temperature
If materials with high thermal resistance are used, then heat resistance is improved, but flexibility and embrittlement resistance worsen
Solution Approach 1:
The patent introduces local quality variation through the three distinct repeating units in the copolymer, each contributing different properties: Formula 1 provides thermal resistance through polysiloxy-aromatic groups, Formula 2 contributes to flexibility and processability, and Formula 3 enhances crosslinking capability. This local differentiation of functional units within the polymer chain enables simultaneous achievement of heat resistance and flexibility.
Solution Approach 2:
The composite resin system combines the copolymer with a crosslinkable monomer and initiator to create a crosslinked network structure. This composite approach allows the material to exhibit high thermal resistance from the copolymer backbone while the crosslinked network provides flexibility and prevents embrittlement, resolving the contradiction between heat resistance and mechanical flexibility.
3Manufacturing precision
If photoresist layers are made with high resolution, then manufacturing precision is improved, but flexibility and thermal resistance deteriorate
Solution Approach 1:
The copolymer resin system performs multiple functions simultaneously: the polysiloxy-aromatic groups provide thermal resistance, the copolymer structure enables high-resolution photoresist patterning through controlled polymerization and crosslinking, and the overall composition ensures flexibility. This multi-functional design eliminates the need for separate materials for each property, resolving the contradiction between resolution and thermal resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides flexible devices with high heat resistance, low dielectric constant, high transmittance, and improved resolution, suitable for use in mobile devices and displays, with pattern resolution less than 30 μm and suitable for use as photoresist layers.
Implementation Method 1
a resin composition, which includes 1 part by weight of the aforementioned copolymer; 0.01 to 0.1 parts by weight of an initiator; and 0.05 to 0.6 parts by weight of a crosslinkable monomer
Data Source
AI summary
A copolymer is provided, which includes 1 part by mole of a repeating unit represented by Formula 1, 3 to 10 parts by mole of a repeating unit represented by Formula 2, and 5 to 15 parts by mole of a repeating unit represented by Formula 3. R1 is hydrogen or methyl; R2 is a single bond or C1-3 alkylene group; R3 is a polysiloxy group with vinyl and aromatic group; and each of R4 and R5 is independently hydrogen, C1-3 alkyl or a polysiloxy group with vinyl and aromatic group.