Copolymer Volatility Reduction in Copper Clad Laminates
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Solution Overview
Problem
Existing materials for copper clad laminate face challenges such as volatility of phenylvinylsilane during high-temperature processing, leading to waste and altered material properties, which fail to meet requirements for characteristics like glass transition temperature, peeling strength of copper foil, dielectric constant, or dissipation factor.
Innovation Solution
A copolymer is developed using phenylvinylsilane and a vinyl-containing compound A, with specific weight ratios and structural formulas, which is then incorporated into a resin composition along with a vinyl-containing polyphenylene ether resin and a polyolefin resin, to enhance the performance of copper clad laminate materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If phenylvinylsilane is used directly in copper clad laminate materials, then the material can be processed, but it volatilizes during high-temperature heating causing waste and property changes
Solution Approach 1:
The patent introduces a pre-reacted intermediate compound that has already undergone partial reaction before being incorporated into the copper clad laminate material. This preliminary action prevents the volatility issue during subsequent high-temperature processing, as the reactive phenylvinylsilane has been converted into a more stable intermediate form that maintains material properties during heating.
2Strength
If phenylvinylsilane is used directly, then the formulation is simple, but the glass transition temperature and peeling strength do not meet requirements
Solution Approach 1:
The patent employs a composite material system consisting of multiple components including the pre-reacted intermediate compound, additional monomers, and other resin materials. This composite approach allows optimization of specific properties such as peeling strength and glass transition temperature through the synergistic combination of different materials, achieving high performance while managing formulation complexity.
Solution Approach 2:
The patent optimizes the glass transition temperature and peeling strength by carefully controlling the composition ratios and reaction conditions of the intermediate compound. By adjusting parameters such as the degree of pre-reaction, monomer ratios, and curing conditions, the material achieves the required mechanical and thermal properties without excessive formulation complexity.
3Reliability
If phenylvinylsilane is used directly, then the processing is straightforward, but the dielectric constant and dissipation factor fail to meet high-frequency requirements
Solution Approach 1:
The patent uses a composite resin system that includes the pre-reacted intermediate compound combined with other dielectric materials. This composite structure enables optimization of dielectric properties such as low dielectric constant and dissipation factor for high-frequency applications, while the intermediate compound provides a stable foundation that simplifies the overall composition design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copolymer and resin composition improve the glass transition temperature, peeling strength of copper foil, dielectric constant, and dissipation factor of copper clad laminate materials, reducing volatility and enhancing overall performance.
Implementation Method 1
a copolymer, comprising a structural unit formed from phenylvinylsilane and vinyl-containing compound A
Data Source
AI summary
Disclosed is a copolymer, including a structural unit formed from phenylvinylsilane and vinyl-containing compound A; the raw materials of the copolymer include phenylvinylsilane and vinyl-containing compound A; based on a total weight of phenylvinylsilane and the vinyl-containing compound A being 100 parts by weight, phenylvinylsilane is 80 to 98 parts by weight, and vinyl-containing compound A is 2 to 20 parts by weight. Also disclosed is a method of preparing the copolymer, including performing a reaction of 80 to 98 parts by weight of phenylvinylsilane and 2 to 20 parts by weight of vinyl-containing compound A. Also disclosed is a resin composition including the copolymer, a method of preparing the resin composition, a use of the resin composition in preparing a product, and a product of which at least a portion is made from the resin composition.