Co-simulating Chip Package Board Power Models
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Solution Overview
Problem
Current power delivery network (PDN) analysis tools face challenges in efficiently modeling complex power/ground plane pairs with internal discontinuities, leading to high computational overhead and inefficiencies in power integrity and IRDrop analysis, particularly when dealing with intricate shapes and configurations such as splits, voids, and stitched vias.
Innovation Solution
A computer-implemented method for co-simulating chip, package, and board power models, including performing IRDrop and power integrity analyses, and optimizing the PDN system by modifying stackup and decoupling capacitors, while using adaptive mesh modeling and method of moments techniques to reduce computational complexity and improve accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If uniform mesh modeling is used to model complex power/ground plane pairs with internal discontinuities, then the model can accommodate complex shapes and configurations, but the computational overhead becomes prohibitive
Solution Approach 1:
The patent segments the power/ground plane pair model into discrete transmission line segments arranged in a grid pattern. Each segment represents a portion of the plane structure, allowing complex shapes to be modeled by selectively activating or deactivating segments based on the actual geometry, rather than using a dense uniform mesh throughout the entire area.
Solution Approach 2:
The patent applies local quality by varying the mesh density and segment characteristics according to the local geometric features of the power/ground plane pair. Areas with internal discontinuities, splits, or vias have specialized segment models that capture local electromagnetic behavior, while uniform areas use simpler representations, optimizing computational efficiency where possible.
2Measurement precision
If transmission line modeling is employed to analyze frequency dependent characteristics, then power integrity analysis can be performed during design stage, but the analysis becomes computationally intensive for complex geometries
Solution Approach 1:
The patent creates a universal transmission line segment model that can represent multiple types of power/ground plane configurations through a single standardized cell structure. By using identical segment models throughout the grid and varying only their interconnection patterns and boundary conditions, the system achieves multi-functionality in modeling different geometries without requiring separate complex models for each case.
Solution Approach 2:
The patent uses partial action by modeling only the essential electromagnetic behavior of each plane segment through simplified transmission line equations, rather than performing full-wave electromagnetic analysis on the entire complex structure. This partial modeling approach captures the dominant frequency-dependent characteristics while avoiding the computational expense of complete electromagnetic simulation.
3Manufacturing precision
If a large number of cells are used to populate the entire power/ground plane pair model, then complex internal boundaries can be accurately represented, but the simulation time and resource requirements increase significantly
Solution Approach 1:
The patent divides the power/ground plane pair into a systematic grid of transmission line segments, where each segment corresponds to a specific geometric region. This segmentation allows accurate representation of complex internal boundaries by simply changing which segments are active and how they are connected, rather than increasing overall model density uniformly across the entire structure.
Solution Approach 2:
The patent performs preliminary geometric analysis to identify and classify different regions of the power/ground plane pair before constructing the transmission line model. This preliminary action allows the modeler to pre-determine which segments will be needed and how they should be configured, avoiding the need to create and process unnecessary segments during the actual simulation phase.
Data Source
AI summary
The subject application relates to a method and system for power delivery network analysis. The present disclosure is directed towards a computer-implemented method for analyzing a power delivery network (PDN) system. The method may include receiving at least one of a chip power model, a package power model and a board power model at the computing device and co-simulating at least two of the chip power model, the package power model, and the board power model. Numerous other features are also within the scope of the present disclosure.