Copper Algicidal Coating Particle Size Optimization
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Solution Overview
Problem
Current algae-resistant coatings using copper compounds are inefficient due to high copper waste, as the copper ions in larger particles do not leach effectively, leading to discoloration of building materials from algae infestation.
Innovation Solution
A coating composition with a ceramic binder and inorganic copper compound particles of median size less than 5 micrometers, which includes photocatalytic and non-photocatalytic cuprous or cupric oxide, is developed to enhance copper ion release and reduce copper usage while maintaining algae resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If larger copper compound particles (median particle size ≥7 micrometers) are used in coatings, then the coating structure is easier to manufacture, but copper ion leaching rate decreases and copper waste increases
Solution Approach 1:
The patent changes the critical parameter of particle size from ≥7 micrometers to <5 micrometers (preferably 1-4 micrometers). This parameter change increases the surface area to volume ratio, enabling copper ions to leach more effectively from the particle core while reducing copper waste and improving algaecidal efficiency.
2Reliability
If high amounts of copper compound (in excess of 50 weight percent solids) are loaded into coatings, then algae resistance is maintained, but copper waste increases due to inefficient leaching from particle centers
Solution Approach 1:
By changing the particle size parameter to <5 micrometers, the patent enables effective copper ion leaching from previously underutilized particle cores. This allows reduction of copper compound loading from >50 weight percent to lower amounts while maintaining algae resistance, thereby reducing copper waste.
3Ease of manufacture
If larger copper particles are used, then manufacturing cost is reduced, but copper ion release efficiency decreases leading to discoloration from algae infestation
Solution Approach 1:
The patent optimizes the particle size parameter to <5 micrometers, which balances manufacturing considerations with copper ion release efficiency. The smaller particle size enables effective leaching from particle centers, preventing algae infestation and discoloration while remaining economically viable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coating composition effectively reduces copper waste by improving the leaching rate of copper ions, providing long-term algae resistance and maintaining the appearance of building materials for extended periods.
Implementation Method 1
The copper ions in the compounds are released, or leached, over time as the coating is subjected to weathering and water
Data Source
AI summary
The present application is directed to a coating composition comprising a ceramic binder and inorganic copper compound particles. Generally, the inorganic copper compound particles have a median particle size of less than 5 micrometers. In some embodiments, the particles have a median particle size of greater than 1 micrometer. The inorganic copper compound particles may be non-photocatalytic. The coating may also be placed on a structural layer.