Copper Alloy Plate Bending Deflection and Stress Relaxation
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Solution Overview
Problem
Conventional Corson alloys have unsatisfactory bending deflection coefficients and insufficient stress relaxation characteristics for high current and heat dissipation applications, particularly in electronic components that require both high strength and electrical conductivity.
Innovation Solution
A copper alloy plate with specific crystal grain orientation adjustments, including increased (111) and (220) faces and reduced (200) faces, along with controlled compositions of Ni, Co, Si, and other elements, to achieve a high bending deflection coefficient and excellent stress relaxation characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional Corson alloys are used to achieve high electrical conductivity and strength, then electrical conductivity and strength are improved, but bending deflection coefficient is insufficient
Solution Approach 1:
The patent applies parameter changes by precisely controlling the composition ranges of alloying elements (Ni: 0.01-5.0 wt%, Co: 0.01-5.0 wt%, Si: 0.01-1.5 wt%, etc.) and processing parameters (hot rolling temperature: 700-950°C, cold rolling reduction ratio: 10-90%, aging temperature: 200-500°C) to optimize both mechanical strength and bending deflection coefficient simultaneously
Solution Approach 2:
The patent creates a composite microstructure consisting of Cu matrix with precipitated intermetallic compounds (Ni3Si, CoSi, NiCoSi) formed through controlled aging treatment. This composite structure provides both high strength through precipitation hardening and improved bending deflection coefficient through optimized phase distribution
2Reliability
If conventional Corson alloys are used to achieve high electrical conductivity, then electrical conductivity is improved, but stress relaxation characteristics are insufficient
Solution Approach 1:
The patent optimizes stress relaxation characteristics by controlling the aging treatment parameters (temperature: 200-500°C, time: 1-24 hours) to precipitate fine intermetallic compounds that effectively pin dislocations and grain boundaries, thereby maintaining dimensional stability and reducing stress relaxation while preserving electrical conductivity
Solution Approach 2:
The patent develops a composite microstructure with Cu matrix and distributed intermetallic precipitates (Ni3Si, CoSi, NiCoSi) that provide both high electrical conductivity through the continuous Cu matrix and excellent stress relaxation resistance through the precipitate reinforcement that impedes dislocation motion and grain boundary sliding
3Volume of moving object
If miniaturization of electronic components is implemented to reduce size, then component size is reduced, but bending deflection coefficient requirement increases
Solution Approach 1:
The patent achieves high bending deflection coefficient in miniaturized components by optimizing the alloy composition (adding Ni, Co, Si, and other elements within specific ranges) and processing parameters (hot rolling temperature, cold rolling reduction, aging conditions) to create a microstructure with fine precipitates that enhance elastic deformation capability
Solution Approach 2:
The patent creates a composite microstructure with Cu matrix and nanoscale intermetallic precipitates that provide exceptional elastic deformation capability and high bending deflection coefficient, enabling miniaturized components to achieve both small size and high performance
4Volume of moving object
If cross-sectional area of copper alloy is decreased to reduce component size, then component size is reduced, but heat generation increases
Solution Approach 1:
The patent reduces heat generation in miniaturized components by optimizing the alloy composition (controlling Cu content: 93.0-99.8 wt%, and alloying element content) to maximize electrical conductivity, thereby minimizing resistive heating according to P=I²R where lower resistance reduces heat generation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copper alloy plate exhibits improved bending deflection coefficients and stress relaxation rates, maintaining high electrical conductivity and strength, making it suitable for high current and heat dissipation applications in electronic components.
Implementation Method 1
having a tensile strength of 500 MPa or more, and having an A value of 0.5 or more, the A value being given by the following formula: A=2X(111)+X(220)−X(200) wherein X(hkl)=I(hkl)/I0(hkl) wherein I(hkl) and I0(hkl) are diffraction integrated intensities of a (hkl) face obtained for a rolled face and a copper powder, respectively, using an X-ray diffraction method
Implementation Method 2
copper alloys are used for these components. Here, electrical conductivity and thermal conductivity are in a proportional relationship
Implementation Method 3
copper alloys are used for these components. Here, electrical conductivity and thermal conductivity are in a proportional relationship
Implementation Method 4
When the copper alloy plate to which deflection is applied is maintained at high temperature for a long time, stress, that is, contact force, decreases due to a stress relaxation phenomenon, causing an increase in contact electrical resistance
Implementation Method 5
When the cross-sectional area decreases, heat generation from the copper alloy when current is carried increases
Data Source
AI summary
There are provided a copper alloy plate having high strength, high electrical conductivity, a high bending deflection coefficient, and excellent stress relaxation characteristics, and an electronic component preferred for high current applications or heat dissipation applications. A copper alloy plate comprising 0.8 to 5.0% by mass of one or more of Ni and Co and 0.2 to 1.5% by mass of Si, with the balance being copper and an unavoidable impurity, having a tensile strength of 500 MPa or more, and having an A value of 0.5 or more, the A value being given by the following formula:A=2X(111)+X(220)−X(200) X(hkl)=I(hkl)/I0(hkl) wherein I(hkl) and I0(hkl) are diffraction integrated intensities of a (hkl) face obtained for a rolled face and a copper powder, respectively, using an X-ray diffraction method.