Copper Alloy Conductor Strength and Conductivity Balance
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Solution Overview
Problem
Existing copper alloy conductors face challenges in achieving high strength and conductivity while maintaining productivity, particularly in high-tension overhead wires for electric trains and industrial cables, due to limitations in manufacturing methods such as continuous casting and rolling.
Innovation Solution
A copper alloy conductor with a specific composition of 0.001 to 0.1 wt% oxygen and 0.15 to 0.70 wt% Sn, featuring a crystalline structure with 80% or more of Sn oxide dispersed as fine grains, is fabricated using a method involving rapid cooling and multistage-hot-rolling to achieve enhanced tensile strength and conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If solid solution-strengthening alloys with high Sn content (0.4 to 0.7 wt%) are used to enhance strength, then tensile strength is improved, but conductivity is substantially reduced
Solution Approach 1:
The patent optimizes the Sn content parameter to a specific range (0.15 to 0.70 wt%) and controls oxygen content (0.001 to 0.1 wt%), combined with controlled final rolling temperature (500 to 600°C), to achieve the desired balance between strength and conductivity without excessive Sn addition that would harm conductivity
Solution Approach 2:
The patent creates a composite microstructure consisting of fine crystalline grains (average diameter 100 μm or less) with dispersed Sn oxide particles (average diameter 1 μm or less) within the copper matrix, combining grain boundary strengthening with dispersion strengthening to achieve high strength while maintaining conductivity
2Strength
If precipitation-strengthening alloys are used to achieve high strength, then tensile strength is improved, but manufacturing complexity and cost increase due to required thermal treatment steps
Solution Approach 1:
The patent extracts the thermal treatment step from the manufacturing process by using solid solution-strengthening alloys that achieve high strength through controlled rolling and microstructure development alone, eliminating the need for separate precipitation heat treatment steps while maintaining high tensile strength
Solution Approach 2:
The patent changes the strengthening mechanism from precipitation-hardening (requiring thermal treatment) to solid-solution strengthening combined with grain refinement, achieved by controlling composition parameters and rolling temperature parameters, thereby simplifying the manufacturing process
3Ease of manufacture
If conventional hot-rolling at high temperatures (700°C or more) is used, then manufacturing ease is improved, but manufacturing precision of microstructure control deteriorates
Solution Approach 1:
The patent lowers the final rolling temperature parameter to a specific range (500 to 600°C) below conventional temperatures, which enables precise control of crystalline grain size (average diameter 100 μm or less) and Sn oxide dispersion while still maintaining adequate processability through optimized composition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a high-strength and high-conductivity copper alloy conductor suitable for high-tension applications, maintaining productivity and cost-effectiveness by using existing manufacturing equipment.
Implementation Method 1
As solid solution-strengthening alloys, there are Cu—Ag alloys (high-concentration silver), Cu—Sn alloys, Cu—Sn—In alloys, Cu—Mg alloys, Cu—Sn—Mg alloys, etc.
Implementation Method 2
As precipitation-strengthening alloys, there are Cu—Zr alloys, Cu—Cr alloys, Cu—Cr—Zr alloys, etc.
Data Source
AI summary
A copper alloy conductor has a copper alloy material which has a copper parent material with 0.001 to 0.1 wt % (=10 to 1000 wt·ppm) of oxygen and 0.15 to 0.70 wt % (exclusive of 0.15 wt %) of Sn. A crystalline grain to form a crystalline structure of the copper alloy material has an average diameter of 100 μm or less, and 80% or more of an oxide of the Sn is dispersed in a matrix of the crystalline structure as a fine oxide grain with an average diameter of 1 μm or less.