Copper-Alloy Potentiometric Sensor Element With Enamel Bonding

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Solution Overview

Problem

Existing potentiometric sensors with solid terminal leads require complex manufacturing processes and lack robustness under mechanical and thermal loads.

Innovation Solution

A sensor element with a copper-based alloy substrate and an ion-selective enamel layer, where the substrate region connected to the enamel layer is made of a copper-based alloy with at least 60% copper, allowing for a simple manufacturing process and improved mechanical and thermal stability through a copper(I)-oxide transition zone.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a solid terminal lead is used in potentiometric sensors, then manufacturing complexity is reduced, but robustness under mechanical and thermal loads deteriorates

Engineering Contradiction:
Improvemanufacturing complexityVSAvoidrobustness under mechanical and thermal loads
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies composite materials by combining a copper-based alloy substrate with an ion-selective enamel layer. The copper-based alloy provides mechanical strength and thermal stability, while the enamel layer provides ion-selectivity. This composite structure resolves the contradiction by integrating the manufacturing simplicity of solid leads with the robustness of materially engineered composites.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent utilizes parameter changes by controlling the copper content in the alloy substrate (at least 60% copper by mass) and managing the oxidation state of copper during manufacturing. By optimizing these parameters, the patent achieves both ease of manufacture and robustness under mechanical and thermal loads, resolving the technical contradiction.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If a copper-based alloy substrate is used, then mechanical and thermal stability is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvemechanical and thermal stabilityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies parameter changes by specifying precise compositional parameters (at least 60% copper by mass) and processing parameters (temperature ranges for enameling). This controlled parameter approach achieves mechanical and thermal stability while keeping the manufacturing process manageable, rather than overly complex.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses an intermediary approach by introducing a copper(I)-oxide transition zone as an intermediate layer between the copper-based alloy substrate and the ion-selective enamel layer. This intermediary layer facilitates the bond between dissimilar materials and enables the manufacturing process to proceed with reasonable complexity while achieving the desired stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If a copper(I)-oxide transition zone is formed, then adhesion and stability are improved, but manufacturing steps increase

Engineering Contradiction:
Improveadhesion and stabilityVSAvoidmanufacturing steps
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by forming the copper(I)-oxide transition zone during the enameling process itself, rather than as a separate subsequent step. The copper(I)-oxide develops in situ as the enamel is applied and heated, creating the necessary adhesion layer proactively during manufacturing rather than requiring additional post-processing steps.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent merges the formation of the copper(I)-oxide transition zone with the enameling process. By combining these two functions into a single manufacturing step, the patent achieves improved adhesion and stability without proportionally increasing the number of manufacturing steps, thus resolving the contradiction.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The sensor element achieves a robust and easy-to-produce design with enhanced stability, reducing manufacturing complexity and ensuring reliable performance under various loads.

Implementation Method 1

the substrate region connected to the enamel layer is made of a copper-based alloy with at least 60% copper... through a copper(I)-oxide transition zone

Methodology Applied
Scientific EffectOxidation: Oxidation

Implementation Method 2

the membrane selectively interacts with a specific ionic species contained in the measuring medium, namely with the analyte. Changing the activity or concentration of the ion in the measuring medium causes a relative change in the equilibrium galvanic voltage

Methodology Applied
Scientific EffectIon-selective interaction: Ion Exchange

Implementation Method 3

The sensor circuit generates an analog or digital measurement signal which represents the electric voltage (potential difference) between the measuring electrode and the reference electrode and, consequently, the activity of the analyte in the measuring medium

Methodology Applied
Scientific EffectPotentiometric measurement: Electric Field

Data Source

PatentUS12553851B2Sensor element for a potentiometric sensor and production method
Publication Date: 2026.02.17 ENDRESS HAUSER CONDUCTA GMBH CO KG
  • US12553851B2 patent drawing
  • US12553851B2 patent drawing

AI summary

The present disclosure relates to a sensor element for a potentiometric sensor, including a substrate and an ion-selective enamel layer arranged on the substrate. The substrate has at least one region which is electroconductively connected to the ion-selective enamel layer. The region of the substrate, which is electroconductively connected to the sensor layer, is made of a copper-based alloy having a mass fraction of at least 60% of copper.