Copper Heat Dissipation Material with Alloy Surface
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional liquid crystal frames used in electronic devices, such as smartphones and electric cars, fail to effectively dissipate heat from components like liquid crystal components and IC chips, leading to potential breakdowns due to accumulated heat.
Innovation Solution
A copper heat dissipation material with a surface alloy layer containing specific metals like Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn, and Mo, and controlled surface roughness, which enhances heat dissipation performance by increasing surface area and radiation factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional liquid crystal frames are used, then the structure is simple and cost-effective, but heat dissipation performance is insufficient leading to component breakdown
Solution Approach 1:
The patent applies composite materials by creating a copper foil with a surface alloy layer containing multiple metals (Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn, Mo). This composite structure combines the high thermal conductivity of copper with the beneficial properties of alloying elements, achieving superior heat dissipation performance while maintaining a relatively simple single-layer structure without complex multi-component assemblies
Solution Approach 2:
The patent applies parameter changes by precisely controlling surface roughness parameters (Sz ≥ 5 μm, Sa ≥ 0.13 μm, Sku ≥ 6) and surface area ratio (A/B ≥ 1.35). These parameter modifications to the copper foil surface enable enhanced heat dissipation through increased surface area and improved radiation factor, transforming an ordinary metal surface into a high-performance heat dissipation surface without changing the fundamental structure
2Reliability
If surface roughness is increased to enhance heat dissipation, then radiation factor and surface area increase, but manufacturing precision becomes more difficult to control
Solution Approach 1:
The patent applies parameter changes by establishing specific ranges for surface roughness parameters (Sz: 5-90 μm, Sa: 0.13 μm or more, Sku: 6 or more) and surface area ratio (A/B: 1.35 or more). These defined parameters provide clear manufacturing targets and acceptance criteria, enabling precise control of surface characteristics while ensuring enhanced heat dissipation performance. The parameter specification transforms a vague quality attribute into a controllable engineering parameter
Solution Approach 2:
The patent applies mechanics substitution by using laser microscope measurement (optical method) instead of traditional contact-based roughness measurement. This non-contact optical measurement technique using 405 nm laser light enables more accurate and less intrusive measurement of the roughened surface, reducing measurement errors and improving manufacturing precision control
3Reliability
If alloy layer is added to copper surface, then heat dissipation performance improves, but manufacturing process becomes more complex
Solution Approach 1:
The patent applies composite materials by forming a surface alloy layer on copper foil containing multiple metal elements (Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn, Mo). This alloying process creates a composite material structure that leverages the high thermal conductivity of copper combined with the beneficial properties of alloying elements, achieving enhanced heat dissipation performance through material composition rather than complex structural design
Solution Approach 2:
The patent applies parameter changes by controlling the composition and thickness of the surface alloy layer. By adjusting metallurgical parameters such as alloying element concentrations and surface treatment conditions, the manufacturing process achieves the desired heat dissipation performance through material parameter optimization rather than complex process sequences
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copper heat dissipation material effectively dissipates transition, radiation, and convection heat, preventing component breakdown and improving the reliability of electronic devices.
Implementation Method 1
copper heat dissipation material effectively dissipates transition, radiation, and convection heat
Implementation Method 2
copper heat dissipation material effectively dissipates transition, radiation, and convection heat
Implementation Method 3
copper heat dissipation material effectively dissipates transition, radiation, and convection heat
Implementation Method 4
surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 μm or more
Data Source
AI summary
A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 μm or more.