Copper Alloy Leaf Spring for Camera Module Drive Mechanism
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Solution Overview
Problem
The challenge is to create a leaf spring for camera module drive mechanisms that maintains sufficient electrical conductivity and spring strength even when thinned, as existing leaf springs with reduced thickness face issues with electrical conductivity and spring strength, particularly when used with heavy or light lenses.
Innovation Solution
A leaf spring produced using a copper alloy material with a stress of at least 1150 MPa at 0.2% strain and 1000 MPa at 0.025% strain, featuring a parallelogram or trapezoidal cross-sectional shape, and made from materials like beryllium-copper, nickel-tin-copper, or titanium-copper, which allows for expansion/contraction and maintains high electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the leaf spring thickness is decreased to make the camera module thinner, then the camera module thickness is reduced, but the electrical conductivity and spring strength are significantly reduced
Solution Approach 1:
The patent changes the material parameters by using copper alloy with specific stress characteristics (stress at 0.2% strain ≥1150 MPa, stress at 0.025% strain ≥1000 MPa). This allows the leaf spring to maintain sufficient spring strength and electrical conductivity even at reduced thickness, resolving the contradiction between thinning the camera module and maintaining reliability.
2Length of moving object
If the leaf spring thickness is decreased to make the camera module thinner, then the camera module thickness is reduced, but the spring strength is significantly reduced
Solution Approach 1:
The patent changes the material parameters by using copper alloy with specific stress characteristics (stress at 0.2% strain ≥1150 MPa, stress at 0.025% strain ≥1000 MPa). This allows the leaf spring to maintain sufficient spring strength even at reduced thickness, resolving the contradiction between thinning the camera module and maintaining strength.
3Reliability
If a heavy lens is used, then the imaging performance is improved, but the leaf spring thickness must be increased to maintain spring strength
Solution Approach 1:
The patent changes the material parameters by using copper alloy with high stress characteristics (stress at 0.2% strain ≥1150 MPa, stress at 0.025% strain ≥1000 MPa). This enables the leaf spring to support heavy lenses while maintaining reduced thickness, resolving the contradiction between maintaining spring strength and reducing thickness.
4Weight of moving object
If a light lens is used, then the camera module weight is reduced, but the leaf spring thickness must be decreased to match the lighter load
Solution Approach 1:
The patent changes the material parameters by using copper alloy with specific stress characteristics. This allows the leaf spring to be thinned for light lens applications while still maintaining sufficient electrical conductivity and spring strength, resolving the contradiction between reducing weight and maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures reduced reduction in electrical conductivity and spring strength, even at decreased thickness, preventing deformation under impact and maintaining stable performance in camera module drive mechanisms.
Implementation Method 1
the leaf-spring material has a stress at 0.2% strain of not less than 1150 MPa and a stress at 0.025% strain of not less than 1000 MPa
Implementation Method 2
the leaf-spring material has a stress at 0.2% strain of not less than 1150 MPa and a stress at 0.025% strain of not less than 1000 MPa
Data Source
AI summary
There is provided a leaf spring which can prevent a reduction in the spring strength and can also prevent a reduction in the electrical conductivity when the thickness of the leaf spring is decreased. The leaf spring includes an outer frame portion an inner frame portion 5b, 11b disposed inside the outer frame portion 5a, 11a, and spring portions provided between the inner frame portion and the outer frame portion The leaf spring is made of a Cu-based alloy, and has an electrical conductivity of not less than 8% IACS and a 0.2% proof stress of not less than 900 MPa.