Copper Alloy Composition for Terminals
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Solution Overview
Problem
Cu-Mg alloys used in electronic and electric devices face issues with insufficient cold workability, bendability, and castability due to high P content and coarse precipitate formation, which affects their ability to be shaped and used in high-temperature environments.
Innovation Solution
A copper alloy with Mg content between 0.15 and 0.35 mass% and P content between 0.0005 and 0.01 mass%, where the mass ratio of Mg to P satisfies specific relationships, enhancing strength, stress relaxation resistance, and castability without compromising electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If P content is increased to improve castability, then castability is improved, but cold workability and bendability deteriorate due to coarse precipitate formation
Solution Approach 1:
The patent applies parameter changes by precisely controlling the P content range (0.003-0.03 mass%) and establishing a specific relationship between Mg and P contents ([Mg]+20×[P]＜0.5). This quantitative parameter optimization prevents coarse precipitate formation while maintaining improved castability, thereby resolving the contradiction between castability and cold workability.
Solution Approach 2:
The patent creates a composite microstructure by controlling the interaction between Mg and P elements in the copper matrix. The specific compositional relationship ([Mg]+20×[P]＜0.5) ensures fine precipitate distribution rather than coarse formation, achieving both improved castability and maintained cold workability through controlled composite material design.
2Strength
If Mg content is increased to improve strength, then strength is improved, but electrical conductivity deteriorates
Solution Approach 1:
The patent applies parameter changes by establishing an optimal Mg content range (0.03-0.35 mass%) and defining the specific relationship [Mg]+20×[P]＜0.5. This precise parameter control achieves sufficient strength improvement while limiting the negative impact on electrical conductivity, resolving the contradiction between these two properties.
Solution Approach 2:
The patent applies local quality by creating a non-uniform distribution of Mg and P elements through controlled precipitate formation. The specific compositional relationship ensures that strengthening precipitates are formed locally without excessive accumulation, thereby improving strength while maintaining overall electrical conductivity.
3Stability of the object's composition
If P content is increased to suppress precipitate coarsening, then precipitate coarsening is suppressed, but cold workability deteriorates due to excessive precipitate formation
Solution Approach 1:
The patent applies parameter changes by optimizing P content within a narrow range (0.003-0.03 mass%) and establishing the specific relationship [Mg]+20×[P]＜0.5. This precise parameter control suppresses precipitate coarsening while preventing excessive precipitate formation, thereby maintaining both composition stability and cold workability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The alloy exhibits improved strength, stress relaxation resistance, and castability while maintaining high electrical conductivity, making it suitable for components like terminals, connectors, and busbars, even in high-temperature environments.
Implementation Method 1
a copper alloy... consisting of: Mg in a range of 0.15 mass% or more and less than 0.35 mass%; P in a range of 0.0005 mass% or more and less than 0.01 mass%... the strength and the stress relaxation resistance can be improved without greatly decreasing the electrical conductivity by solid melting Mg in the Cu matrix phase
Implementation Method 2
coarsening of precipitates including Mg and P is suppressed by setting the contents of Mg and P included in the alloy in a range defined by a predetermined relational expression
Data Source
Figure 1
AI summary
A copper alloy for and electric and an electronic device is provided. The copper alloy includes: Mg in a range of 0.15 mass% or more and less than 0.35 mass%; P in a range of 0.0005 mass% or more and less than 0.01 mass%; and a Cu balance including inevitable impurities. In the copper alloy, a Mg content [Mg] and a P content [P], both of which are in a mass ratio, satisfy a relationship expressed by [Mg]+20×[P]<0.5, and an electrical conductivity of the copper alloy is more than 75%IACS.