Copper Alloy Powder for Additive Manufacturing

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Solution Overview

Problem

Current additive manufacturing methods for metal products, particularly those using pure copper, struggle to achieve both adequate mechanical strength and electrical conductivity due to issues with density and void formation, making it difficult to produce parts with consistent properties.

Innovation Solution

Developing a copper alloy powder with specific compositions of chromium and silicon, combined with a controlled additive manufacturing process involving layer formation and heat treatment, to produce additively-manufactured articles with enhanced mechanical strength and electrical conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If pure copper powder is used for additive manufacturing, then electrical conductivity is improved, but mechanical strength deteriorates due to density issues and void formation

Engineering Contradiction:
Improveelectrical conductivityVSAvoidmechanical strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent uses composite copper alloy powder containing copper base material with dispersed alloying elements (silver, gold, platinum, palladium, or their combinations). This composite structure allows the matrix to provide electrical conductivity while the dispersed particles enhance mechanical strength and prevent void formation during additive manufacturing, resolving the contradiction between electrical conductivity and mechanical strength.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the chemical composition parameters of the copper powder by controlling the content of alloying elements (silver: 0.01-1.0 mass%, gold: 0.01-1.0 mass%, platinum: 0.01-1.0 mass%, palladium: 0.01-1.0 mass%). By optimizing these compositional parameters, the material achieves both high electrical conductivity and adequate mechanical strength, resolving the contradiction through parameter optimization.

Inventive Principle:
Principle #35Parameter changes

2Strength

If copper alloy powder with alloying elements is used, then mechanical strength is improved, but electrical conductivity deteriorates

Engineering Contradiction:
Improvemechanical strengthVSAvoidelectrical conductivity
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent optimizes the concentration parameters of alloying elements by limiting silver to 0.01-1.0 mass%, gold to 0.01-1.0 mass%, platinum to 0.01-1.0 mass%, and palladium to 0.01-1.0 mass%. These controlled low concentrations provide mechanical strength enhancement while minimizing the negative impact on electrical conductivity, resolving the contradiction through precise parameter control.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite structure where copper serves as the continuous matrix phase providing electrical conductivity, while dispersed particles of alloying elements provide mechanical reinforcement. This composite architecture allows both functions to coexist, resolving the contradiction between mechanical strength and electrical conductivity.

Inventive Principle:
Principle #40Composite materials

3Strength

If high alloy content is used to improve mechanical strength, then mechanical strength is improved, but manufacturing precision deteriorates due to void formation

Engineering Contradiction:
Improvemechanical strengthVSAvoiddensity uniformity
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The patent optimizes the alloy content parameters by maintaining low concentrations of alloying elements (0.01-1.0 mass% each), which provides sufficient mechanical strength while ensuring good powder flowability and packing density. This prevents void formation during additive manufacturing, resolving the contradiction between mechanical strength and manufacturing precision.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent ensures homogeneous distribution of alloying elements within the copper matrix through controlled powder production processes. This homogeneity prevents localized void formation and ensures uniform density throughout the additively manufactured part, resolving the contradiction between mechanical strength and manufacturing precision.

Inventive Principle:
Principle #33Homogeneity

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The copper alloy powder with chromium or silicon content between 0.10% and 1.00% mass% achieves additively-manufactured articles with relative densities above 96% and electrical conductivities exceeding 26% IACS, ensuring stable and balanced mechanical and electrical properties.

Implementation Method 1

a second step of forming a shaped layer by solidifying the metal powder at a predetermined position in the powder layer

Methodology Applied
Scientific EffectSolidification: Freezing

Implementation Method 2

a heat treatment step of heat-treating the additively-manufactured article

Methodology Applied
Scientific EffectHeat treatment: Heat Treatment

Data Source

PatentUS11077495B2Metal powder, method of producing additively-manufactured article, and additively-manufactured article
Publication Date: 2021.08.03 OSAKA RES INST OF IND SCI & TECH
  • US11077495B2 patent drawing
  • US11077495B2 patent drawing
  • US11077495B2 patent drawing

AI summary

A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.