Copper Alloy Resistive Component with Oxide Layer for Low TCR
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Solution Overview
Problem
Conventional resistive components for detecting electric current face challenges in achieving low resistance values and temperature coefficients of resistance (TCR) due to the use of glass and copper-oxide powders, which require precise control and can lead to increased resistance and porous structures, and the copper oxidation during high-temperature sintering processes, making the manufacturing process complex and costly.
Innovation Solution
A resistive component with a copper alloy resistive layer and an upper oxide layer formed by oxidation treatment, which increases adhesion and stability under high temperatures, maintaining low resistance values and TCR, and simplifies the manufacturing process by eliminating the need for sintering in a nitrogen environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If glass powders and copper-oxide powders are added into the resistive layer to reduce resistance value and TCR, then adhesion between substrate and resistive layer is improved, but resistance value increases and porous structure forms when percentage exceeds 10 wt %
Solution Approach 1:
The patent removes glass powders and copper-oxide powders from the resistive layer formulation, using only copper-based materials (copper foil, copper powder, copper alloy powder) to eliminate the need for precise percentage control while maintaining adhesion through copper oxide formation
Solution Approach 2:
The patent changes the material composition parameters by eliminating glass and copper-oxide powders, using only copper-based materials with controlled particle sizes (0.01-0.5mm for copper powder, 0.01-0.1mm for copper alloy powder) to achieve both adhesion and precise resistance control
2Ease of manufacture
If sintering is performed at 960° C. ̃980° C. in nitrogen environment to manufacture the resistive component, then the resistive layer is formed, but copper oxidation occurs making the manufacturing process more difficult
Solution Approach 1:
The patent uses nitrogen atmosphere during sintering at 960-980°C to prevent copper oxidation, maintaining process simplicity while ensuring proper resistive layer formation
Solution Approach 2:
The patent performs oxidation treatment on the copper foil surface before sintering to pre-form copper oxide, which then serves as the resistive layer material, eliminating the need for separate oxidation steps during sintering
3Adaptability or versatility
If vaporization or sputtering deposition process is used to deposit resistive layers on copper foil, then resistive layers with different resistance values can be manufactured, but manufacture cost increases and etching process becomes more difficult
Solution Approach 1:
The patent uses conventional, inexpensive materials (copper foil, copper powder, copper alloy powder) and standard sintering processes instead of expensive vaporization or sputtering equipment, achieving cost-effective manufacturing while maintaining versatility in resistance value production through material composition control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a resistive component with a low resistance value and low TCR, enhancing stability and reliability under high temperatures while simplifying the manufacturing process and reducing costs.
Implementation Method 1
an upper oxide layer directly disposed on a part of the resistive layer
Implementation Method 2
performing oxidation treatment to form a roughened surface having oxide of the copper alloy on a part of the resistive layers
Data Source
AI summary
A resistive component suitable for detecting electric current in a circuit and a method of manufacturing the resistive component are provided. The resistive component includes a carrier, a resistive layer, an electrode unit, an upper oxide layer and a protective layer. The resistive layer comprises copper alloy and is disposed on the carrier. The electrode unit is electrically connected to the resistive layer. The upper oxide layer is disposed on a part of a surface of the resistive layer and includes oxides of the resistive layer. The protective layer covers at least a part of the upper oxide layer.