Copper Alloy Sheet Material Crystal Orientation Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Copper alloy sheet materials face challenges in achieving a balance between high yield strength, satisfactory bending workability, and electrical conductivity, with existing solutions either compromising on strength or conductivity.
Innovation Solution
A copper alloy sheet material with a specific alloy composition containing Ni, Co, and Si, and a production method involving intermediate and final cold-rolling, aging treatment, and stress-relief annealing, which suppresses the {121} orientation and enhances the {110} orientation density, achieving high yield strength and bending workability while maintaining electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high strength copper alloy is used, then yield strength is improved, but bending workability deteriorates
Solution Approach 1:
The invention changes the crystallographic orientation parameters of the copper alloy by controlling the rolling process. Specifically, it increases the area ratio of the (100) plane facing the rolled direction to 20% or more while controlling the (111) plane orientation, thereby achieving both high strength and good bending workability through parameter optimization rather than material composition changes
Solution Approach 2:
The invention creates a composite microstructure within the copper alloy by combining specific crystal orientations ((100) and (111) planes) and precipitation hardening phases. This composite microstructure at the microscopic level provides both the strength from precipitation hardening and the bending workability from favorable crystal orientations
2Volume of moving object
If small-sized terminals are used, then equipment size is reduced, but electrical conductivity deteriorates
Solution Approach 1:
The invention changes the material parameters by optimizing the alloy composition (Cu-1.8 to 8.0 at% Ni, Cu-0.4 to 2.0 at% Si, and optional third elements) and crystal orientation parameters. This enables small-sized terminals to maintain high electrical conductivity through superior material properties rather than increasing size
3Strength
If high strength copper alloy is used, then yield strength is improved, but electrical conductivity deteriorates
Solution Approach 1:
The invention optimizes multiple parameters simultaneously: alloy composition (Ni: 1.8-8.0 at%, Si: 0.4-2.0 at%, plus optional elements), crystal orientation ((100) plane area ratio ≥20%, controlled (111) plane orientation), and precipitation hardening phase distribution. This multi-parameter optimization achieves both high strength and satisfactory electrical conductivity that cannot be achieved by single-parameter changes
Solution Approach 2:
The invention creates a composite microstructure combining precipitation hardening phases (Ni-rich and Si-rich phases) with favorably oriented copper matrix grains. This composite structure provides strength from the precipitates while maintaining electrical conductivity through the continuous copper matrix pathway
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a copper alloy sheet material with enhanced yield strength, bending workability, and electrical conductivity, suitable for applications in electronic equipment and automotive connectors, reducing the risk of permanent deformation and improving contact pressure.
Implementation Method 1
subjecting the alloy to age-precipitation hardening via a particular process
Implementation Method 2
The copper alloy sheet material may have undergone stress-relief annealing
Data Source
AI summary
A copper alloy sheet material, having an alloy composition containing at least one of Ni and Co in an amount of 1.80 to 8.00 mass % in total, Si in an amount of 0.40 to 2.00 mass %, and at least one element selected from the group consisting of Sn, Zn, Ag, Mn, P, Mg, Cr, Zr, Fe, and Ti in an amount of 0.000 to 2.000 mass % in total, with the balance being copper and unavoidable impurities, wherein the orientation density of the {121}<111> orientation is 6 or less, and the orientation density of the {110}<001> orientation is 4 or more; and wherein the density of grains having the {110}<001> orientation is 0.40 grains/μm2 or more; a connector using thereof; and a method of producing the copper alloy sheet material.