Copper Alloy Strip Composition for Heat-Resistant Thermal Dissipation
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Solution Overview
Problem
Conventional copper alloys for electrical and electronic parts, such as those used in vehicles and semiconductor lead frames, face challenges in achieving high thermal conductivity, strength, and bendability while maintaining cost-effectiveness and simplicity in manufacturing processes.
Innovation Solution
A copper alloy strip composition with 0.20-0.40% by mass of chromium (Cr), 0.01-0.15% by mass of cobalt (Co), and optional additives like silicon (Si), magnesium (Mg), and tin (Sn), processed through melting, homogenization heat treatment, hot rolling, water quenching, precipitation heat treatment, and cold rolling to achieve a softening resistant temperature of 450°C or higher and thermal conductivity of 280 W/m·K or more.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional copper alloys (Corson-based or Cu-Cr-based) are used to achieve high strength and heat resistance, then tensile strength can reach 350 MPa or more, but manufacturing process complexity increases due to required solution treatment at 950-1050°C after hot rolling
Solution Approach 1:
The patent changes the chemical composition parameters by adding cobalt (0.01-1.5 mass%) to the copper alloy, which enables the material to achieve high strength without requiring complex solution treatment processes. This compositional modification allows precipitation hardening to occur effectively at lower temperatures, simplifying the manufacturing process while maintaining tensile strength of 350 MPa or more
Solution Approach 2:
The patent extracts the requirement for high-temperature solution treatment from the manufacturing process by using cobalt addition, which enables the alloy to achieve necessary strength through simpler cold rolling and precipitation heat treatment processes alone, thereby removing the complex solution treatment step
2Strength
If conventional copper alloys are used to achieve high strength, then tensile strength can reach 350 MPa or more, but electrical conductivity decreases to 45% IACS or less
Solution Approach 1:
The patent optimizes the alloy composition by adding cobalt within a specific range (0.01-1.5 mass%) and controlling other elements, which allows the material to achieve both high strength (350 MPa or more) and high electrical conductivity (75% IACS or more). This precise parameter control enables simultaneous improvement of both properties that are typically contradictory in copper alloys
Solution Approach 2:
The patent creates a composite microstructure through cobalt addition and controlled rolling processes, forming a refined grain structure with precipitates that simultaneously enhance strength through precipitation hardening while maintaining high electrical conductivity by minimizing harmful phase formation
3Strength
If copper alloy material is processed into cases or can type parts for thermal dissipation, then structural strength is improved to protect from external impact, but thermal dissipation efficiency decreases due to heat accumulation
Solution Approach 1:
The patent develops a copper alloy with composite microstructure through cobalt addition and controlled processing, achieving both high structural strength for protective cases and high thermal conductivity for efficient heat dissipation, eliminating the trade-off between structural integrity and thermal performance in enclosures
4Strength
If cobalt is added to Corson-based alloy to improve strength and conductivity, then yield strength reaches 850 MPa and electrical conductivity reaches 45% IACS, but manufacturing cost increases due to additional solution treatment process
Solution Approach 1:
The patent optimizes the cobalt content range (0.01-1.5 mass%) and combines it with controlled cold rolling and precipitation heat treatment parameters, enabling the alloy to achieve high yield strength (850 MPa) while avoiding the need for expensive solution treatment processes, thereby reducing manufacturing costs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copper alloy strip exhibits enhanced heat resistance, thermal dissipation, strength, and bendability, suitable for various electronic and automotive applications, with improved reliability and reduced manufacturing complexity compared to existing methods.
Implementation Method 1
thermal conductivity of 280 W/m·K or more
Implementation Method 2
precipitation heat treatment
Data Source
AI summary
Disclosed are a copper alloy strip having high heat resistance and thermal dissipation properties which is suitable for a material for shield cans to solve heating of mobile devices, a material for vehicles and semiconductor lead frames, and a material for electrical and electronic parts, such as connectors, relays, switches, etc., widely used in industries including vehicles, and a method of preparing the same.