Ultra-fine Copper Alloy Wire Strength and Conductivity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current copper alloy wires with high mechanical strength and electrical conductivity face challenges in maintaining strength during heat load processes like extrusion and soldering, particularly in the production of ultra-fine wires for medical and electronic devices, where both mechanical reliability and electrical performance are compromised.
Innovation Solution
Development of extra-fine copper alloy wires with a diameter of 0.010 to 0.025 mm, containing 1 to 3 weight % silver, achieving a tensile strength of 850 MPa or more and electrical conductivity of 85% IACS or more, with a heat treatment at 300 to 500°C for 0.2 to 5 seconds to minimize strength reduction, and optionally plated with tin, silver, or nickel for enhanced properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If tin (Sn) is added to copper alloy to enhance mechanical strength, then tensile strength increases, but electrical conductivity decreases
Solution Approach 1:
The patent changes the alloying element from tin (Sn) to silver (Ag) and adjusts the composition parameters (1-3 wt% Ag, 0.010-0.025mm diameter) to achieve both high strength (≥850 MPa) and high conductivity (≥85% IACS) simultaneously
Solution Approach 2:
The patent creates a composite copper-silver alloy system that combines the high ductility and conductivity of copper with the strength-enhancing properties of silver, achieving superior mechanical and electrical properties compared to traditional Cu-Sn alloys
2Reliability
If copper alloy wire undergoes heat treatment to improve electrical conductivity, then conductivity increases, but mechanical strength decreases
Solution Approach 1:
The patent performs preliminary cold working to achieve ≥95% area reduction before heat treatment, creating a microstructure that maintains high strength after subsequent heat treatment while achieving the desired conductivity improvement
Solution Approach 2:
The patent optimizes the heat treatment parameters (temperature, time) and alloy composition (1-3 wt% Ag) to achieve a balance where conductivity increases to ≥85% IACS while maintaining tensile strength ≥850 MPa
3Length of moving object
If wire diameter is reduced to achieve ultra-fine dimensions for miniaturized devices, then device size decreases, but mechanical strength and heat resistance deteriorate
Solution Approach 1:
The patent achieves ultra-fine dimensions (0.010-0.025mm diameter) while maintaining high strength (≥850 MPa) through optimized alloy composition (1-3 wt% Ag) and extensive cold working (≥95% area reduction), enabling miniaturization without sacrificing mechanical properties
Solution Approach 2:
The copper-silver alloy composition provides superior strength-to-diameter ratio in ultra-fine wires, maintaining mechanical integrity and heat resistance even at 0.010mm diameter through the synergistic effects of silver reinforcement and copper ductility
4Length of moving object
If extensive cold working is performed to achieve ultra-fine wire diameter, then wire diameter decreases, but production complexity and time increase
Solution Approach 1:
The patent performs preliminary drawing to intermediate dimensions before final ultra-fine drawing, and applies heat treatment at strategic points during the drawing process to reduce work hardening and facilitate continued reduction to target diameters
Solution Approach 2:
The optimized alloy composition (1-3 wt% Ag) provides improved ductility and workability that reduces the number of drawing passes required to achieve ultra-fine dimensions, improving production efficiency while maintaining dimensional precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides wires with high mechanical strength and low electrical resistance, maintaining strength during heat load processes, suitable for ultra-fine applications, ensuring both mechanical reliability and high transmission performance in medical and electronic devices.
Implementation Method 1
conducting a heat treatment to the extra-fine copper alloy wire at a temperature of 300 to 500° C. for 0.2 to 5 seconds
Data Source
AI summary
An extra-fine copper alloy twisted wire including a plurality of copper alloy wires with a wire diameter of 0.010 to 0.025 mm twisted together, each of the copper alloy wires including 1 to 3 weight % of silver (Ag) and a balance consisting of a copper and an inevitable impurity, the copper alloy twisted wire further including a tensile strength of not less than 850 MPa, and an electrical conductivity of not less than 85% IACS. The extra-fine copper alloy twisted wire includes a solid insulation with a thickness of not more than 0.07 mm formed on an outer circumference of the extra-fine insulated wire.