Copper-Alloy Wiring Board Microstructure for Strength and Conductivity

The invention applies local quality by creating a non-uniform microstructure within the copper alloy where different regions have different properties. The sea-island structure consists of a copper-rich sea phase providing conductivity and an alloy-rich island phase providing strength, while the lamellar structure alternates between soft and hard layers. This local differentiation allows simultaneous achievement of high conductivity in copper-rich regions and high strength in alloy-rich regions.

The invention effectively creates a composite material system within the copper alloy by forming a sea-island structure where copper-rich phases and alloy-rich phases coexist. The copper-rich sea phase acts as the matrix providing electrical conductivity, while the alloy-rich island phases dispersed within serve as reinforcement providing mechanical strength. This internal composite structure resolves the contradiction between conductivity and strength.

The conductor layer containing copper alloy applies local quality by creating copper-rich regions that provide high conductivity and alloy-rich regions that provide mechanical strength. The sea-island structure ensures that copper-rich sea phases form continuous conductive pathways while alloy-rich island phases are dispersed to provide reinforcement without significantly impeding electrical flow.

The copper alloy conductor layer functions as a composite material with copper-rich phases providing electrical conductivity and alloy-rich phases providing mechanical strength. This internal composite structure allows the wiring to simultaneously achieve both high conductivity for signal transmission and high strength for mechanical durability.