Copper Wire with Cu-Ni-Zn Barrier Layer for Display Signal Lines
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Solution Overview
Problem
As display devices increase in size, the length of signal wires increases, leading to higher resistance due to reduced width, which is not effectively addressed by existing technologies.
Innovation Solution
A metal wire structure incorporating a copper layer with barrier layers containing copper, nickel, and zinc, where the barrier layers are strategically placed on both sides of the copper layer to enhance adhesion, prevent diffusion, and adjust etching rates, thereby reducing resistance and improving conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the width of the signal wire is reduced to accommodate larger display sizes, then the area occupied by the wire is reduced, but the resistance in the signal wire increases
Solution Approach 1:
The patent employs a composite wire structure consisting of multiple material layers including copper, molybdenum, and tungsten. The copper layer provides low resistance for electrical conduction, while the molybdenum and tungsten layers provide mechanical strength and diffusion barrier properties. This composite structure enables the wire to maintain low resistance even at reduced widths, resolving the contradiction between minimizing wire area and maintaining low resistance.
2Reliability
If copper is used to reduce resistance, then the electrical conductivity is improved, but material diffusion and adhesion issues arise
Solution Approach 1:
The patent introduces molybdenum and tungsten layers as intermediary materials between the copper layer and the surrounding environment. These intermediary layers serve dual functions: they act as diffusion barriers to prevent copper atoms from migrating into adjacent layers, and they provide excellent adhesion to both the copper layer and the substrate or insulating layers. This mediator approach allows the copper layer to maintain its low resistance property without suffering from diffusion and adhesion problems.
Solution Approach 2:
The multi-layer composite structure combines copper's excellent electrical conductivity with molybdenum's and tungsten's diffusion barrier and adhesion properties. Each material is selected for its specific characteristics, and their combination creates a wire structure that simultaneously achieves low resistance, prevents material diffusion, and ensures strong adhesion throughout the device.
3Area of stationary object
If the length of the signal wire is increased for larger displays, then the coverage area is improved, but the resistance increases due to reduced width
Solution Approach 1:
The composite wire structure with copper, molybdenum, and tungsten layers enables the signal wire to be made longer for larger display coverage while maintaining low resistance. The copper layer ensures excellent electrical conduction over the extended length, while the supporting molybdenum and tungsten layers maintain structural integrity and prevent degradation, allowing the wire to span larger areas without excessive resistance accumulation.
Data Source
AI summary
Provided is a metal wire. The metal wire includes a copper layer, and at least one barrier layer. The barrier layer is disposed on at least one of an upper part and a lower part of the copper layer. The barrier layer includes an alloy including copper, nickel, and zinc.