Copper Base Plate Shielded IC Package for Lower-Cost EMI Control
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Solution Overview
Problem
The high cost and poor reliability of electromagnetic shielding in integrated circuit packages due to the use of substrates, which also have low thermal conductivity, necessitate a more cost-effective and reliable solution using a copper base plate for improved performance.
Innovation Solution
A package method involving a copper base plate with electroplating, etching to form a transition layer with functional and grounding pins, followed by encapsulation and the application of a metal protective layer to create an electromagnetic shielding structure that connects grounding pins to a shielding cover, reducing manufacturing costs while enhancing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a substrate is used to achieve electromagnetic shielding effect, then the shielding function is realized, but the manufacturing cost increases significantly (about 10 times higher than copper base plate)
Solution Approach 1:
The patent replaces expensive substrate with a much cheaper copper base plate to achieve the same electromagnetic shielding function. The copper base plate costs about 1/10th of substrate while providing equivalent or superior shielding performance, directly resolving the cost contradiction.
Solution Approach 2:
The patent changes the material parameter from substrate to copper base plate, and modifies the structural parameters by adding electroplating layers and specific grounding patterns. This parameter transformation maintains shielding effectiveness while dramatically reducing manufacturing cost.
2Ease of manufacture
If a substrate is used as carrier plate, then packaging is achieved, but the thermal conductivity is poor
Solution Approach 1:
The patent changes the material parameter from substrate to copper base plate. Copper inherently possesses superior thermal conductivity compared to substrate materials, thus resolving the thermal conductivity issue while maintaining packaging functionality.
Solution Approach 2:
The patent creates a composite structure by combining copper base plate with electroplating layers (such as nickel or gold plating). This composite material approach leverages copper's excellent thermal conductivity while adding surface properties suitable for electrical connections and shielding.
3Ease of manufacture
If a substrate is used as carrier plate, then packaging is achieved, but the reliability is low (only MSL3 achievable)
Solution Approach 1:
The patent changes the material parameter from substrate to copper base plate with electroplating layers. This material substitution improves reliability from MSL3 to higher levels by providing better electrical conductivity, lower impedance, and enhanced signal integrity, thereby resolving the reliability contradiction.
Solution Approach 2:
The patent employs a composite structure of copper base plate with electroplating layers to achieve both packaging capability and high reliability. The copper provides mechanical support and thermal management, while the electroplating layers provide electrical conductivity and corrosion resistance, together achieving MSL3 or higher reliability levels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the electromagnetic shielding effectiveness and reduces costs by using a copper base plate, enhancing reliability and thermal conductivity, and achieving efficient electromagnetic interference reduction.
Implementation Method 1
performing electroplating in an electroplating area of the base plate to form an electroplating layer on the base plate
Data Source
AI summary
The present invention discloses an electromagnetic shielding package structure and a package method thereof. The package method for the electromagnetic shielding package structure includes: providing a base plate of a copper raw material, and forming a transition layer after two photoresist film operations, wherein the transition layer includes conductive connecting ribs connecting functional pins to an outer side wall; mounting a chip. performing first encapsulating, and etching off the conductive connecting ribs connecting the functional pins to the outer side wall; performing secondary encapsulating on an etched part; and after forming a singulated body by cutting, blocking the connection between the functional pins and the outer side wall by a plastic package material, and only reserving grounding pins to be connected to the outer side wall through the conductive connecting ribs. In this way, after a metal protective layer is sputtered, only the conductive connecting ribs and the shielding cover are enabled to be conducted to form the electromagnetic shielding package structure. According to the present invention, the performance of the package is improved, and the manufacturing cost and the use cost are reduced.