Copper Bonding Composition via Wet Medium Exchange for Sinter Adhesion
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Solution Overview
Problem
Existing methods for producing conductive pastes and powders do not adequately address the adhesion of metal particles to other components during sintering, leading to potential detachment and poor bonding.
Innovation Solution
A method involving the production of copper particles using a wet reduction method in a first liquid medium, followed by replacing this medium with a second liquid medium while keeping the dispersion wet, to enhance adhesion in sintering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal powder is produced using conventional drying methods, then the production process is simple, but the adhesion to other components during sintering deteriorates
Solution Approach 1:
The invention changes the physical state parameter of the metal powder from dry to wet, maintaining it in a wet cake form with controlled moisture content (5-50 wt%). This parameter change prevents adhesion deterioration during sintering while keeping the production process relatively simple, resolving the contradiction between reliability and process complexity.
Solution Approach 2:
The invention creates a composite structure by combining metal powder with moisture to form a wet cake. This composite material maintains the metal particles in a dispersed state during storage and handling, and the moisture acts as a bonding agent that improves adhesion to other components during sintering, thereby improving reliability without significantly complicating the production process.
2Reliability
If metal powder particles are aggregated, then the handling and processing is easier, but the dispersibility deteriorates
Solution Approach 1:
The invention uses a moisture layer (thin film) to coat the metal powder particles, forming a flexible wet cake structure. This moisture film prevents particle aggregation while maintaining ease of handling as a cohesive mass, and ensures good dispersibility when the moisture evaporates during sintering, resolving the contradiction between dispersibility and ease of manufacture.
Solution Approach 2:
The invention introduces moisture as an intermediary substance between metal powder particles. This intermediary prevents direct contact and aggregation of metal particles during storage and handling, yet allows for easy processing as a wet cake. During sintering, the moisture evaporates leaving well-dispersed metal particles, thus improving dispersibility without compromising ease of manufacture.
3Reliability
If conventional conductive paste production methods are used, then the production cost is low, but the adhesion to components deteriorates
Solution Approach 1:
The invention optimizes the moisture content parameter within a specific range (5-50 wt%) to achieve excellent adhesion to components during sintering. By controlling this parameter, the invention improves reliability (adhesion) while maintaining reasonable quantity of substance (not excessive moisture), resolving the contradiction between adhesion quality and material efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a bonding composition with excellent adhesion to other components during sintering, reducing the likelihood of detachment and improving the bonding quality.
Implementation Method 1
producing copper particles in a first liquid medium using a wet reduction method
Data Source
AI summary
A method is provided for producing a bonding composition containing copper particles and a second liquid medium. In this production method, the copper particles are produced in a first liquid medium using a wet reduction method, and thus a dispersion of the copper particles is prepared. Subsequently, the first liquid medium in the dispersion is ultimately, finally or eventually replaced with the second liquid medium while the dispersion is kept wet. It is also preferable that the first liquid medium is replaced with another liquid medium one or more times, and the second liquid medium is used in the final replacement. The liquid media are preferably replaced at a temperature of lower than 100° C. The second liquid medium preferably includes one or more of water, alcohol, ketone, ester, ether, and hydrocarbon.