Copper Boss LED Substrate for Height Alignment and Heat Dissipation
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Solution Overview
Problem
The existing encapsulation method for light-emitting modules, which involves fastening a pad to a circuit layer of the substrate for adjusting the installation height of light-emitting elements, leads to decreased thermal conductivity and affects the heat dissipation performance due to solder connections.
Innovation Solution
A substrate design with a top copper layer that includes copper layer bosses to adjust the height of light-emitting elements, ensuring they are on the same horizontal plane, and incorporates insulated channels and barrier layers to enhance thermal conductivity and prevent encapsulation adhesive intrusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a pad is fastened to the circuit layer through bottom solder welding to adjust light-emitting element height, then the installation height can be adjusted, but the thermal conductivity between the light-emitting element and substrate decreases
Solution Approach 1:
The patent extracts the height adjustment function from the pad structure and relocates it to the copper layer boss. The pad is removed as a separate component, and its height-adjustment function is integrated into the copper layer boss structure itself, eliminating the need for bottom solder welding that compromised thermal conductivity.
Solution Approach 2:
The patent merges the height adjustment function with the copper layer boss structure. The copper layer boss simultaneously serves as the electrical connection path, the height adjustment mechanism, and the thermal conduction path, eliminating the need for separate pad structures and solder connections.
2Manufacturing precision
If a pad is used with top solder connection to fasten light-emitting elements, then height adjustment is achieved, but heat dissipation performance is affected
Solution Approach 1:
The patent extracts the height adjustment function from the pad structure and relocates it to the copper layer boss. The pad is removed as a separate component, and its height-adjustment function is integrated into the copper layer boss structure itself, eliminating the need for bottom solder welding that compromised thermal conductivity.
Solution Approach 2:
The patent employs a composite structure where the copper layer boss integrates multiple functions (electrical connection, height adjustment, thermal conduction) into a single copper-based structure, eliminating the need for heterogeneous material joints (pad + solder + substrate) that created thermal resistance.
3Illumination intensity
If the light-emitting element installation height is adjusted to meet light quality requirements, then light emission quality improves, but the structural complexity increases
Solution Approach 1:
The patent merges the height adjustment function with the copper layer boss structure. The copper layer boss simultaneously serves as the electrical connection path, the height adjustment mechanism, and the thermal conduction path, eliminating the need for separate pad structures and solder connections.
Solution Approach 2:
The copper layer boss is designed as a multi-functional structure that performs electrical connection, height adjustment, and thermal conduction simultaneously, eliminating the need for separate components and reducing overall structural complexity despite achieving precise height control for light quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution maintains consistent light emission quality by adjusting element heights and improves thermal conductivity, ensuring reliable electrical connections and effective heat dissipation while preventing encapsulation adhesive interference.
Implementation Method 1
The copper layer boss is configured to adjust the height of the light emission surface of a light-emitting element disposed in the light-emitting element installation region so that the height of the light emission surface of any light-emitting element disposed in the light-emitting element installation region is on the same horizontal plane
Implementation Method 2
improves thermal conductivity, ensuring reliable electrical connections and effective heat dissipation
Implementation Method 3
incorporates insulated channels and barrier layers to enhance thermal conductivity and prevent encapsulation adhesive intrusion
Data Source
AI summary
A substrate includes a substrate body and a top copper layer disposed on the substrate body. Multiple insulated channels are disposed on the top copper layer. The top copper layer forms a top circuit structure based on the multiple insulated channels. A light-emitting element installation region is disposed on the top layer circuit structure. The top copper layer in the light-emitting element installation region protrudes upward to form at least one copper layer boss. Multiple light-emitting element welding positions are disposed in the light-emitting element installation region. A light-emitting element welding position is disposed on any copper layer boss. The copper layer boss is configured to adjust the height of the light emission surface of a light-emitting element disposed in the light-emitting element installation region.