Copper Busbar Titanium Coating Corrosion Resistance
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Solution Overview
Problem
Existing plating processing apparatuses face challenges with copper busbars due to low corrosion resistance of copper against acidic plating solutions, leading to resin lining peeling and potential copper corrosion, as well as complex and costly manufacturing processes involving high-temperature diffusion bonding, which can reduce copper strength and increase electrical resistance.
Innovation Solution
The use of copper-made busbars with a titanium-made coating layer, featuring a gap between the copper base member and the titanium coating layer to enhance corrosion resistance and reduce thermal stress, along with direct welding and T-like shaped connections to minimize electrical resistance and facilitate easy assembly and maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If copper busbars are used for electrical connection in plating processing apparatus, then high electrical conductivity is achieved, but corrosion resistance against acidic plating solutions deteriorates
Solution Approach 1:
The busbar is constructed as a composite structure with a copper base member providing high electrical conductivity and a titanium coating layer providing corrosion resistance against acidic plating solutions. This composite design allows the busbar to simultaneously achieve both high electrical conductivity and reliable corrosion resistance in the plating environment.
2Reliability
If resin lining is applied to copper busbars to improve corrosion resistance, then protection against plating solution is enhanced, but the lining peels off due to thermal stress from current flow
Solution Approach 1:
Instead of applying resin lining to copper, the invention uses a titanium coating layer directly bonded to the copper busbar. The titanium coating provides corrosion resistance without the adhesion problems of resin lining, as it forms a metallurgical bond with the copper base member and can accommodate thermal expansion differences.
3Reliability
If high-temperature diffusion bonding is used to coat titanium on copper busbars, then corrosion resistance is improved, but copper strength is reduced and electrical resistance increases
Solution Approach 1:
The invention changes the bonding parameters from high-temperature diffusion bonding to low-temperature bonding methods. The titanium coating is bonded to the copper base member at temperatures that avoid excessive copper grain growth and strength loss, while still achieving adequate bonding strength and corrosion resistance.
4Use of energy by moving object
If tight bonding between copper base member and titanium coating is achieved, then electrical conductivity is improved, but thermal stress causes coating delamination
Solution Approach 1:
The invention applies different bonding qualities to different regions of the busbar. The titanium coating is tightly bonded to the copper base member at the surfaces in contact with plating solution to provide corrosion resistance, while allowing controlled gaps or less tight bonding in internal regions to accommodate thermal expansion and prevent delamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides busbars with high corrosion resistance, stable long-term performance, and reduced electrical resistance, enabling efficient and reliable plating processes without the need for complex high-temperature manufacturing steps.
Implementation Method 1
copper-made base member and a titanium-made coating layer covering a surface of the base member
Implementation Method 2
a portion of the busbar member other than the first connection portion and the second connection portion includes a gap between the base member and the coating layer
Implementation Method 3
a first busbar electrically connecting the power supply roller and the control panel; and a second busbar electrically connecting the anode case and the control panel
Data Source
AI summary
A plating processing apparatus in which a plating object is immersed in a plating solution to form a plating layer on a surface of the plating object. A plating tank contains the plating solution, and a power supply roller is rotated while supplying electric power to the plating object, and conveys the plating object to be immersed into the plating solution contained in the plating tank and then moved to the outside of the plating solution. An anode case is disposed inside the plating tank and held in electrical contact with the plating solution contained in the plating tank, and a control panel controls electric power supplied to the power supply roller and the anode case. A first busbar electrically connects the power supply roller and the control panel, and a second busbar electrically connects the anode case and the control panel.