Copper-Ceramic Substrate Surface for Direct Silver Sinter Bonding
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Solution Overview
Problem
Existing copper-ceramic substrates require a precious metal coating for effective bonding with electronic components, which is technically complex and costly, and there is a need for a method to achieve cohesive connections without such coatings.
Innovation Solution
A copper-ceramic substrate with a copper layer treated to have a specific energy spectrum, as analyzed by X-ray photoelectron spectroscopy, allowing for a strong sintered connection with electronic components using silver-based sintered material, eliminating the need for precious metal coatings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the copper-ceramic substrate surface is coated with a precious metal coating (silver or gold) to facilitate bonding, then the bonding strength and adhesion are improved, but the manufacturing complexity and cost increase due to additional coating steps
Solution Approach 1:
The invention extracts and removes the precious metal coating layer from the substrate surface, achieving bonding without requiring silver or gold coatings. The copper-ceramic substrate surface is directly used for bonding electronic components, eliminating the intermediate coating step while maintaining bonding effectiveness through optimized surface properties and bonding process parameters.
Solution Approach 2:
The invention replaces expensive precious metal coatings with a cost-effective approach using the copper-ceramic substrate surface directly. By utilizing the inherent surface properties of the copper layer and optimizing the bonding process, the need for costly protective or bonding-enhancing coatings is eliminated, reducing material costs and manufacturing complexity.
2Reliability
If a precious metal coating is applied to the copper-ceramic substrate to enable sintered material bonding, then the adhesion is improved, but the manufacturing time and process steps increase
Solution Approach 1:
The precious metal coating step is completely removed from the manufacturing process. The copper-ceramic substrate surface is prepared and used directly for bonding electronic components, eliminating the time required for coating application, drying, and sintering of the precious metal layer, thereby reducing total manufacturing time while maintaining adhesion through direct bonding processes.
3Ease of manufacture
If the copper layer surface is treated to achieve a specific energy spectrum ratio (GF1/GF2 ≥ 0.25) for direct bonding, then the manufacturing process is simplified by eliminating precious metal coatings, but the surface treatment requirements become more stringent
Solution Approach 1:
The invention changes the surface energy characteristics of the copper layer by controlling the GF1/GF2 ratio to be at least 0.25 through surface treatment processes. This parameter optimization enables direct bonding without precious metal coatings. The surface treatment is controlled to achieve the required energy spectrum ratio, balancing process simplicity with achievable surface modification precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method provides a strong and stable adhesive connection between the copper-ceramic substrate and electronic components, enhancing the bonding strength and simplifying the manufacturing process by avoiding precious metal coatings.
Implementation Method 1
a copper layer which is bonded to the ceramic body, the copper layer having a top side, where an energy spectrum obtained by X-ray photoelectron spectroscopy upon analysis of the upper side of the copper layer has at least one signal S1 comprising at least one peak P1 having a maximum in the range of 526 eV - 538 eV
Implementation Method 2
allowing for a strong sintered connection with electronic components using silver-based sintered material
Data Source
AI summary
The invention relates, among other things, to a copper-ceramic substrate. This comprises: a) a ceramic body and b) a copper layer which is planarly bonded to the ceramic body, wherein the copper layer has a top surface, wherein an energy spectrum obtained by analyzing the top surface of the copper layer by X-ray photoelectron spectroscopy, (i) has at least one signal S1 comprising at least one peak P1 with a maximum in the range of 526 eV - 538 eV, wherein the at least one peak P1 has an area PF1, wherein the areas PF1 of all peaks P1 of the at least one signal S1 give a total area GF1, and (ii) has at least one signal S2 comprising at least one peak P2 with a maximum in the range of 0 eV - 1400 eV, wherein the at least one peak P2 has an area PF2, wherein the areas PF2 of all peaks P2 of the at least one signal S2 give a total area GF2, wherein the ratio GF1 / GF2 is at least 0.25.