Copper-Ceramic Substrate Surface Oxidation for Sintered Bonding
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Solution Overview
Problem
Existing copper-ceramic substrates require a precious metal coating for effective bonding with electronic components, which is technically complex and adds manufacturing steps, and conventional copper oxides do not promote strong sintered connections.
Innovation Solution
A copper-ceramic substrate with a copper layer treated to have an energy spectrum indicating the presence of copper(II) oxide, allowing for a strong sintered connection with electronic components without a precious metal coating, using methods like plasma treatment to achieve the desired oxide composition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the copper-ceramic substrate surface is coated with a precious metal coating to achieve strong bonding with electronic components, then the bonding strength is improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The invention extracts and eliminates the precious metal coating layer from the substrate structure. By modifying the copper layer's surface properties through controlled oxidation, the patent removes the intermediate precious metal layer while maintaining the bonding function, thereby simplifying the manufacturing process and reducing costs.
Solution Approach 2:
The invention changes the chemical composition and surface properties of the copper layer by controlling the oxidation process. By adjusting the oxygen content and creating specific copper oxide phases on the copper layer surface, the patent enables direct bonding with electronic components without requiring precious metal coatings.
2Ease of manufacture
If conventional copper oxide is used on the copper layer surface, then the manufacturing process is simplified, but the sintered connection strength is insufficient
Solution Approach 1:
The invention precisely controls the oxidation parameters of the copper layer, including oxygen concentration, temperature, and exposure time. This creates a specific copper oxide layer with optimized chemical composition and microstructure that provides both ease of manufacture and strong sintered connections.
Solution Approach 2:
The invention creates a composite structure within the copper layer, combining metallic copper with controlled copper oxide phases. This composite microstructure provides both the electrical conductivity of copper and the bonding affinity of copper oxide, achieving strong sintered connections without complex manufacturing.
3Strength
If the copper layer is heavily oxidized to improve bonding, then the bonding affinity increases, but the electrical conductivity and thermal conductivity decrease
Solution Approach 1:
The invention applies local oxidation only to the surface region of the copper layer, creating a gradient structure where the surface has copper oxide for bonding affinity while the bulk remains metallic copper for conductivity. This localized treatment maintains electrical and thermal performance while providing sufficient bonding affinity.
Solution Approach 2:
The invention precisely controls oxidation parameters to limit oxygen penetration depth and concentration. By optimizing temperature, time, and oxygen exposure, the patent creates a thin copper oxide layer at the surface that provides bonding affinity without significantly affecting the bulk electrical and thermal conductivity properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copper-ceramic substrate achieves a strong, cohesive connection with electronic components using sintered material, enhancing thermal stability and simplifying the manufacturing process by eliminating the need for precious metal coatings.
Implementation Method 1
a copper layer which is bonded to the ceramic body, the copper layer having a top side, where an energy spectrum obtained by X-ray photoelectron spectroscopy analysis of the upper surface of the copper layer has a signal comprising at least one peak P1 with a maximum in a range of 933.2 eV - 934.0 eV
Implementation Method 2
using methods like plasma treatment to achieve the desired oxide composition
Implementation Method 3
The copper-ceramic substrate achieves a strong, cohesive connection with electronic components using sintered material
Data Source
Figure 1
AI summary
The invention relates to a copper-ceramic substrate, the use of a copper-ceramic substrate, and a method for producing a metallurgical bond between a copper-ceramic substrate and an electronic component. The copper-ceramic substrate comprises: a) a ceramic body and b) a copper layer that is bonded to the ceramic body over a planar area, wherein the copper layer has a top surface, wherein an energy spectrum obtained from an analysis of the top surface of the copper layer by X-ray photoelectron spectroscopy exhibits a signal that includes at least one peak P1 with a maximum in the range of 933.2 eV - 934.0 eV.