Copper-Ceramic Substrate Surface for Direct Sintered Silver Bonding
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Solution Overview
Problem
Existing copper-ceramic substrates require a precious metal coating for effective bonding with electronic components, which is technically complex and adds manufacturing steps.
Innovation Solution
A copper-ceramic substrate with a copper layer that has a specific energy spectrum profile, as analyzed by X-ray photoelectron spectroscopy, allowing for a cohesive connection with electronic components without the need for a precious metal coating, utilizing a process that includes plasma treatment and sintered silver material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a precious metal coating is applied to the copper-ceramic substrate surface, then bonding strength with electronic components is improved, but manufacturing complexity and production time increase
Solution Approach 1:
The invention extracts and eliminates the precious metal coating layer from the substrate structure. By developing a copper alloy substrate with specific compositional characteristics (controlled oxygen content and specific element ratios), the patent achieves direct bonding capability without requiring the additional precious metal coating layer, thereby simplifying the overall structure and manufacturing process while maintaining bonding strength
Solution Approach 2:
The invention changes the chemical composition parameters of the copper substrate itself. By controlling the content of specific elements (oxygen, silver, gold, palladium, etc.) and establishing specific ratio relationships between them, the substrate material is modified to inherently possess sintering activation capability, replacing the need for surface coating with material composition optimization
2Strength
If a precious metal coating is applied to the copper-ceramic substrate surface, then adhesion with sintered material is improved, but the number of manufacturing steps increases
Solution Approach 1:
The precious metal coating step is extracted and removed from the manufacturing process. The copper alloy substrate is designed with inherent sintering activation capability through controlled composition, allowing direct bonding with sintered materials without the intermediate coating step, thus reducing manufacturing steps and improving productivity
Solution Approach 2:
The copper substrate material itself is designed to provide the sintering activation function that previously required a separate precious metal coating. The specific compositional characteristics of the copper alloy enable it to self-activate the sintering process, making the substrate material self-sufficient for bonding purposes
3Strength
If the copper layer surface is treated to achieve specific energy spectrum profile, then cohesive connection with electronic components is improved, but surface treatment complexity increases
Solution Approach 1:
Instead of applying complex surface treatments to modify the copper surface, the invention changes the bulk compositional parameters of the copper layer. By controlling the content ratios of specific elements during substrate fabrication, the desired surface characteristics and sintering activation properties are achieved inherently, avoiding complex post-fabrication surface treatment processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate achieves a strong, cohesive connection with electronic components using sintered silver, enhancing adhesion strength and simplifying the manufacturing process by eliminating the need for precious metal coatings.
Implementation Method 1
the silver it contains can easily diffuse into the precious metal-containing coating of the copper-ceramic substrate
Implementation Method 2
the electronic component is often bonded to the copper-ceramic substrate using a sintered material containing silver. During the sintering process, the silver forms a materially bond between the surfaces
Implementation Method 3
utilizing a process that includes plasma treatment and sintered silver material
Data Source
AI summary
The invention relates to a copper-ceramic substrate, the use of a copper-ceramic substrate, and a method for producing a metallurgical bond between a copper-ceramic substrate and an electronic component. The copper-ceramic substrate comprises a) a ceramic body and b) a copper layer that is bonded to the ceramic body over a planar area, the copper layer having a top surface. Before and after sputtering the top surface for 120 s, the copper-ceramic substrate exhibits an energy spectrum, obtained by X-ray photoelectron spectroscopy analysis of the top surface of the copper layer, which makes the copper-ceramic substrate particularly suitable for metallurgical bonding with an electronic component using a sintered material comprising silver.