Copper Ceramic Substrate Stamping and Sintering Method
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Solution Overview
Problem
The existing manufacturing methods for copper ceramic substrates using Direct Bonding Copper (DBC) are complex, environmentally unfriendly due to material waste and non-uniform etching, and inefficient in terms of cost and performance, with significant environmental and performance issues.
Innovation Solution
A manufacturing method involving stamping a copper sheet into a circuit board with uniform vertical side walls, direct bonding with a ceramic substrate using a Cu—Cu2O eutectic liquid phase in a controlled oxidation atmosphere, and optional surface coating, which simplifies the process, reduces thermal resistance, and enhances insulation and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional etching process is used to manufacture copper circuit board, then copper circuit board can be produced, but large amounts of copper dissolve in etching liquid causing environmental pollution and left over material is difficult to process
Solution Approach 1:
The patent extracts and eliminates the etching process entirely from the manufacturing sequence. Instead of using chemical etching to remove copper, the design directly forms copper circuit boards through stamping and sintering, where copper is deposited only where needed without requiring subsequent removal of excess material through etching, thereby eliminating copper dissolution pollution
Solution Approach 2:
The patent converts the traditional harmful etching process into a beneficial direct formation process. By using stamping to create precise copper patterns followed by sintering to bond copper to ceramic substrate, the method transforms what was previously a wasteful removal process into an efficient direct creation process, eliminating pollution while maintaining circuit board production
2Manufacturing precision
If traditional etching process is used, then copper circuit board can be manufactured, but lines are not of uniform depth or upright which decreases insulation performance
Solution Approach 1:
The patent replaces the chemical etching mechanism with a mechanical stamping followed by thermal sintering process. The stamping process mechanically forms precise copper patterns with uniform depth and vertical sides, and the subsequent sintering heat treatment consolidates these structures to achieve superior line uniformity and insulation performance without the complexity of multi-step chemical processing
3Strength
If DBC process is used with heat treatment above eutectic temperature, then copper and ceramic substrate can be bonded, but the process requires precise temperature control and additional equipment
Solution Approach 1:
The patent optimizes the sintering temperature parameter to fall within the eutectic range (1063-1083°C), creating ideal bonding conditions. By controlling the temperature to match the eutectic point of copper-copper oxide-ceramic system, the process achieves strong bonding while using standard industrial heating equipment without requiring specialized high-temperature furnaces or complex temperature control systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in copper ceramic substrates with improved insulation performance, reduced thermal resistance, and lower costs, while minimizing environmental impact through reduced material usage and efficient heat dissipation, making them suitable for high-power and high-heat applications.
Implementation Method 1
Direct Bonding Copper (DBC) is a technology that applies a heat treatment at a temperature lower than melting point of copper (about 1083° C.) and higher than eutectic temperature of copper and copper oxide (about 1063° C.) to make a eutectic bond and fix the external structure and copper together
Implementation Method 2
applies a heat treatment at a temperature lower than melting point of copper (about 1083° C.) and higher than eutectic temperature of copper and copper oxide (about 1063° C.) to make a eutectic bond
Implementation Method 3
Stamping a copper sheet (1) into a copper circuit board (1') in a shape matching a ceramic substrate (2)
Implementation Method 4
The oxidation temperature is from 950 to 1100 degrees Celsius, and the oxidation time is from 20 minutes to 35 minutes. In the oxidation heating process, the oxidation atmosphere comprises a weak oxygen atmosphere under the protection of and mixed with inert gas
Implementation Method 5
a Cu—Cu2O eutectic liquid phase is produced where the copper circuit board (1') is combined with the ceramic substrate (2)
Data Source
AI summary
A manufacturing method for circuit board on copper ceramic substrate comprises stamping a copper sheet into a copper circuit board in a shape matching a ceramic substrate, fitting the copper circuit board to the ceramic substrate and sintering the copper circuit board and the ceramic substrate together by direct bonding copper.