Copper-Clad Heat Equalization Plate for Phase-Change Dissipation
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Solution Overview
Problem
Electronic components generate significant heat during operation, which can lead to performance degradation and damage if not effectively dissipated.
Innovation Solution
A heat equalization plate is manufactured using copper-clad laminates with thermally conductive bumps and a connecting bump to form a sealed chamber filled with a working fluid, enhancing heat dissipation through thermal conductivity and fluid phase changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a heat equalization plate is designed to improve heat dissipation, then heat dissipation rate is improved, but device complexity increases due to multiple layers and components
Solution Approach 1:
The patent combines multiple functions into a single integrated heat equalization plate structure. The copper-clad laminates, sealed chamber, and working fluid system are merged into one component that simultaneously provides heat conduction, heat storage, and heat distribution functions, resolving the contradiction between heat dissipation effectiveness and structural complexity
Solution Approach 2:
The patent uses composite material construction with copper-clad laminates (combining copper and insulating materials) to create a structure that provides both high thermal conductivity where needed and thermal insulation where required, achieving effective heat dissipation while maintaining manageable structural complexity
2Temperature
If thermally conductive bumps are added to enhance heat conduction, then heat conduction is improved, but manufacturing complexity increases
Solution Approach 1:
The patent uses electroplating technology (a electrochemical process similar in complexity to pneumatic/hydraulic system integration) to create thermally conductive bumps on the copper foil surfaces. This standardized manufacturing process achieves enhanced heat conduction through the bumps while maintaining relatively straightforward manufacturing procedures
Solution Approach 2:
The patent modifies the surface parameters of the copper foil by adding thermally conductive bumps with specific dimensions and distributions. By optimizing the bump parameters (height, diameter, spacing), the patent achieves improved heat conduction efficiency while keeping the manufacturing process within acceptable complexity levels
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves heat dissipation rates by accelerating heat conduction and equalization, reducing thermal resistance, and ensuring effective temperature management.
Implementation Method 1
A heat equalization plate is manufactured using copper-clad laminates with thermally conductive bumps and a connecting bump to form a sealed chamber filled with a working fluid, enhancing heat dissipation through thermal conductivity and fluid phase changes
Implementation Method 2
A heat equalization plate is manufactured using copper-clad laminates with thermally conductive bumps and a connecting bump to form a sealed chamber filled with a working fluid, enhancing heat dissipation through thermal conductivity and fluid phase changes
Data Source
AI summary
A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber.