Copper Clad Laminate Fine Circuit Patterns via Semi-Additive Process
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Solution Overview
Problem
Current methods for forming high-density circuit patterns on printed circuit boards, particularly fine-line patterns less than 15/15 μm, are limited by the tenting process's inability to form fine-line circuits and the semi-additive process's complexity and low plating adhesion issues with prepreg materials, which are not suitable for forming patterns with line/space smaller than 15/15 μm.
Innovation Solution
A copper clad laminate structure comprising a first copper clad layer on an insulating layer with a polymer resin layer and a carrier foil layer, where the polymer resin layer includes materials like epoxy resin or polyimide, and the carrier foil layer is coated with a benzotriazole-based organic remover or metallic remover, enabling the formation of fine circuit patterns through a semi-additive process by forming via holes using lasers and electroless plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the semi-additive process is used to form fine-line patterns less than 15/15 μm, then the manufacturing precision is improved, but the device complexity increases due to complicated processes and electroless plating requirements
Solution Approach 1:
The patent applies preliminary action by pre-coating the copper foil with a specific surface treatment layer before the semi-additive process. This surface treatment layer is prepared in advance to ensure optimal plating adhesion and facilitate the subsequent electroless plating process, thereby enabling fine-line pattern formation while managing process complexity through advance preparation
Solution Approach 2:
The patent changes material parameters by using a specific surface treatment layer with controlled thickness and composition on the copper foil. This parameter modification optimizes the plating adhesion and electroless plating performance, enabling the formation of fine-line patterns less than 15/15 μm while maintaining manageable process complexity
2Manufacturing precision
If a YAG laser or pico-laser is used to form via holes with 40 μm or less, then the manufacturing precision is improved, but the cost increases compared to CO2 laser
Solution Approach 1:
The patent changes the material parameters of the copper foil surface treatment layer to optimize laser absorption characteristics. By controlling the surface treatment layer's composition and thickness, the patent enables effective via hole formation with CO2 laser at lower costs while achieving the required precision for via holes with 40 μm or less diameter
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the creation of fine circuit patterns and via holes with diameters of 40 μm or less, improving adhesion and reducing process complexity, thereby enabling the production of high-density circuits on printed circuit boards with enhanced precision and cost-effectiveness.
Implementation Method 1
The carrier foil layer may comprise at least one selected from the group consisting of a benzotriazole-based organic remover and a metallic remover such as a cobalt remover as a remover coating
Implementation Method 2
forming via holes using lasers
Implementation Method 3
forming via holes using lasers and electroless plating
Data Source
AI summary
A copper clad laminate and a method to manufacture the same are provided. In one general aspect, a copper clad laminate include a first copper clad layer on a first surface of an insulating layer, and a second copper clad layer on a second surface of the insulating layer. The second copper clad layer includes polymer resin layer, a second copper layer, and a carrier foil layer.