Copper-Clad Laminate Underlying Metal Layer Thickness Control
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Solution Overview
Problem
Thermoplastic resin films used in flexible printed wiring boards lack high heat resistance, leading to potential wrinkles during film-forming and decreased productivity due to deformation, and they struggle to maintain adhesion with conductor layers.
Innovation Solution
A copper-clad laminate with a thermoplastic resin base film and an underlying metal layer formed by a dry plating method, where the underlying metal layer has a mean thickness of 0.3 to 1.9 nm, typically 0.3 to 1.5 nm, and is composed of alloys like nickel, chromium, vanadium, titanium, molybdenum, or copper, ensuring strong adhesion and preventing wrinkles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the temperature of the thermoplastic resin film is increased during film-forming of the underlying layer, then adhesion between the resin film and conductor layer is improved, but wrinkles occur due to deformation of the film
Solution Approach 1:
The patent applies parameter changes by precisely controlling the thickness of the underlying metal layer (0.3 to 1.9 nm) to achieve optimal adhesion while preventing film deformation. This thin layer provides sufficient bonding strength without requiring excessive temperature that would cause wrinkles in the thermoplastic resin film.
Solution Approach 2:
The patent uses composite materials by combining the thermoplastic resin film with a specifically designed underlying metal layer of controlled thickness. This composite structure achieves both good adhesion and wrinkle prevention, as the thin metal layer (0.3-1.9 nm) provides bonding interface without causing thermal deformation of the resin substrate.
2Strength
If a thicker underlying metal layer is used, then adhesion between resin film and conductor layer is improved, but productivity decreases due to film deformation
Solution Approach 1:
The patent optimizes the thickness parameter of the underlying metal layer to 0.3-1.9 nm, which is sufficient to provide adhesion without causing film deformation. This eliminates the need for rework or rejection of deformed films, thereby maintaining high productivity while achieving adequate bonding strength.
3Shape
If a thinner underlying metal layer is used, then wrinkle occurrence is suppressed, but adhesion between resin film and conductor layer deteriorates
Solution Approach 1:
The patent identifies and applies the critical threshold parameter for underlying metal layer thickness (0.3 to 1.9 nm). Within this range, the layer is thin enough to prevent wrinkle formation but thick enough to provide sufficient adhesion strength. The lower limit of 0.3 nm ensures adequate bonding while the upper limit of 1.9 nm prevents thermal deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution maintains adhesion between the resin film and conductor layer while preventing wrinkles by controlling the underlying metal layer's thickness, enhancing the laminate's heat resistance and reducing transmission loss for high-frequency applications.
Implementation Method 1
an underlying metal layer film-formed on a surface of the base film by a dry plating method
Data Source
AI summary
To provide a copper-clad laminate which maintains adhesion between a resin film and a conductor layer and which suppresses the occurrence of wrinkles. A copper-clad laminate has a base film containing a thermoplastic resin, an underlying metal layer film-formed on a surface of the base film by a dry plating method, and a copper layer film-formed on a surface of the underlying metal layer. The underlying metal layer has a mean thickness of 0.3 to 1.9 nm. Since the underlying metal layer has a mean thickness of 0.3 nm or more, it is possible to maintain adhesion between the base film and a conductor layer. Since the underlying metal layer has a mean thickness of 1.9 nm or less, it is possible to suppress an increase in the temperature of a film during film-forming of the underlying metal layer, and it is possible to suppress the occurrence of wrinkles.