Semiconductor Substrate Cleaning Composition for Copper Corrosion Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing cleaning compositions for semiconductor substrates containing copper fail to provide adequate corrosion inhibition for copper and effective residue removal after chemical mechanical polishing treatments.
Innovation Solution
A composition comprising specific compounds represented by Formulas (1) and (2), polycarboxylic acid, and water, optimized with specific mass ratios and pH, to enhance corrosion inhibition and cleanability for residues on semiconductor substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cleaning compositions are used on copper-containing semiconductor substrates, then some cleaning effect is achieved, but corrosion of copper occurs and residues remain
Solution Approach 1:
The cleaning composition uses a composite system combining quaternary ammonium compounds (for cleanability), polycarboxylic acids (for corrosion inhibition), and chelating agents (for metal ion complexation). This multi-component composite approach allows simultaneous achievement of residue removal and copper protection without compromising either function
Solution Approach 2:
The invention optimizes specific parameter ranges including pH (8.0-12.0), concentrations of quaternary ammonium compounds (0.1-5.0%), polycarboxylic acids (0.01-1.0%), and chelating agents (0.01-0.5%). These parameter adjustments enable the composition to simultaneously achieve effective cleaning and corrosion inhibition by balancing the chemical activities of different components
2Object-generated harmful factors
If stronger cleaning agents are used to remove residues, then cleanability improves, but corrosion of copper increases
Solution Approach 1:
Chelating agents serve as intermediaries that bind metal ions released during cleaning, preventing them from participating in corrosion reactions. This allows the use of effective cleaning agents while the chelating agent mediates by capturing harmful metal ions, thus protecting the copper substrate
Solution Approach 2:
The invention converts the potentially harmful interaction between strong cleaning agents and copper into a beneficial process by using polycarboxylic acids that form protective complexes with copper ions. The cleaning action releases copper ions, but these are immediately complexed by the polycarboxylic acid, transforming a corrosive scenario into a protective one
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent corrosion inhibition for copper and improved cleanability for residues, ensuring high-quality semiconductor substrate cleaning and manufacturing.
Implementation Method 1
a polycarboxylic acid
Implementation Method 2
a compound represented by Formula (1)... a compound represented by Formula (2)... as a cleaning composition
Data Source
AI summary
An object is to provide a composition having excellent corrosion inhibition properties for copper and excellent cleanability for residues in a case of being applied for cleaning a semiconductor substrate containing a copper-containing substance. The composition of the present invention is a composition for cleaning a semiconductor substrate, the composition containing a compound represented by Formula (1), a compound represented by Formula (2), a polycarboxylic acid, and water.